Wuu, Shou-Gwo, Chen, Hsin-Li, Chien, Ho-Ching, Enquist, Paul, Guidash, R. Michael, and McCarten, John
Subjects
*CMOS image sensors, *SEALING (Technology), *MASS production
Abstract
Over the past 10 years, 3-dimensional (3-D) wafer-level stacked backside Illuminated (BSI) CMOS image sensors (CISs) have undergone rapid progress in development and performance and are now in mass production. This review paper covers the key processes and technology components of 3-D integrated BSI devices, as well as results from early devices fabricated and tested in 2007 and 2008. This article is divided into three main sections. covers wafer-level bonding technology. covers the key wafer fabrication process modules for BSI 3-D wafer-level stacking. presents the device results. [ABSTRACT FROM AUTHOR]
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]