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The mesophase pitch-based carbon fiber interface material (TIM) with a vertical array was prepared by using mesophase pitch-based short-cut fibers (MPCFs) and 3016 epoxy resin as raw materials and carbon nanotubes (CNTs) as additives through electrostatic flocking and resin pouring molding process. The microstructure and thermal properties of the interface were analyzed by using a scanning electron microscope (SEM), laser thermal conductivity and thermal infrared imaging methods. The results indicate that the plate spacing and fusing voltage have a significant impact on the orientation of the arrays formed by mesophase pitch-based carbon fibers. While the orientation of the carbon fiber array has a minimal impact on the shore hardness of TIM, it does have a direct influence on its thermal conductivity. At a flocking voltage of 20 kV and plate spacing of 12 cm, the interface material exhibited an optimal thermal conductivity of 24.47 W/(m·K), shore hardness of 42 A and carbon fiber filling rate of 6.30 wt%. By incorporating 2% carbon nanotubes (CNTs) into the epoxy matrix, the interface material achieves a thermal conductivity of 28.97 W/(m·K) at a flocking voltage of 30 kV and plate spacing of 10 cm. This represents a 52.1% increase in thermal conductivity compared to the material without TIM. The material achieves temperature uniformity within 10 s at the same heat source temperatures, which indicates a good application prospect in IC packaging and electronic heat dissipation. [ABSTRACT FROM AUTHOR]

Carbon nanotube (CNT)/metal composites have attracted much attention due to their enhanced electrical and thermal performance. How to achieve the scalable fabrication of composites with efficient dispersion of CNTs to boost their performance remains a challenge for their wide realistic applications. Herein, the nanoscale dispersion of CNTs in the Stannum (Sn) matrix to boost thermal and electrical conductivity via facile ball milling techniques was demonstrated. The results revealed that CNTs were tightly attached to metal Sn, resulting in a much lower resistivity than that of bare Sn. The resistivity of Sn with 1 wt.% and 2 wt.% CNTs was 0.087 mΩ·cm and 0.056 mΩ·cm, respectively. The theoretical calculation showed that there was an electronic state near the Fermi level, suggesting its electrical conductivity had been improved to a certain extent. In addition, the thermal conductivity of Sn with 2 wt.% CNTs was 1.255 W·m−1·K−1. Moreover, Young's modulus of the composites with CNTs mass fraction of 10 wt.% had low values (0.933 MPa) under low strain conditions, indicating the composite shows good potential for various applications with different flexible requirements. The good electrical and thermal conductive CNT networks were formed in the metal matrix via facile ball milling techniques. This strategy can provide guidance for designing high-performance metal samples and holds a broad application potential in electronic packaging and other fields. [ABSTRACT FROM AUTHOR]

With the rapid development of the electronics industry, there is a growing demand for packaging materials that possess both high thermal conductivity (TC) and low electrical conductivity (EC). However, traditional insulating fillers such as boron nitride, aluminum nitride, and alumina (Al2O3) have relatively low intrinsic TC. When graphene, which exhibits both superhigh TC and EC, is used as a filler to fill epoxy resin, the TC of blends can be much higher than that of blends containing more traditional fillers. However, the high EC of graphene limits its application in cases where electrical insulation is required. To address this challenge, a method for coating graphene sheets with an in situ grown Al2O3 layer has been proposed for the fabrication of epoxy-based composites with both high TC and low EC. In the presence of a cationic surfactant, a dense Al2O3 layer with a network structure can be formed on the surface of graphene sheets. When the total content of Al2O3 and graphene mixed filler reached 30 wt%, the TC of the epoxy composite reached 0.97 W m−1 K−1, while the EC remained above 1011 Ω·cm. Finite element simulations accurately predicted TC and EC values in accordance with experimental results. This material, with its combination of high TC and good insulation properties, exhibits excellent potential for microelectronic packaging applications. [ABSTRACT FROM AUTHOR]

Diamond/Cu composites are widely studied as a new generation of thermal management materials in the field of electronic packaging and heat sink materials. The surface modification of diamond can improve interfacial bonding between the diamond and Cu matrix. The Ti-coated diamond/Cu composites are prepared via an independently developed liquid-solid separation (LSS) technology. It is worth noting that there are obvious differences for the surface roughness between the diamond-{100} and -{111} face by AFM analysis, which may be related to the surface energy of different facets. In this work, the formation of titanium carbide (TiC) phase makes up the chemical incompatibility between the diamond and copper, and the thermal conductivities of 40 vol.% Ti-coated diamond/Cu composites can be improved to reach 457.22 W·m−1·K−1. The results estimated by the differential effective medium (DEM) model illustrate that the thermal conductivity for 40 vol.% Ti-coated diamond/Cu composites show a dramatic decline with increasing TiC layer thickness, giving a critical value of ~260 nm. [ABSTRACT FROM AUTHOR]

Thermally conductive and electrically insulating composites are important for the thermal management of new generation integrated and miniaturized electronic devices. A practical and eco−friendly electrostatic self−assembly method was developed to prepare boron nitride−multilayer graphene (BN−MG) hybrid nanosheets. Then, BN−MG was filled into silicone rubber (SR) to fabricate BN−MG/SR composites. Compared with MG/SR composites with the same filler loadings, BN−MG/SR composites exhibit dramatically enhanced electrical insulation properties while still maintaining excellent thermal conductivity. The BN−MG/SR with 10 wt.% filler loading shows a thermal conductivity of 0.69 W·m−1·K−1, which is 475% higher than that of SR (0.12 W·m−1·K−1) and only 9.2% lower than that of MG/SR (0.76 W·m−1·K−1). More importantly, owing to the electron blocking effect of BN, the electron transport among MG sheets is greatly decreased, thus contributing to the high−volume resistivity of 4 × 1011 Ω cm for BN−MG/SR (10 wt.%), which is fourorders higher than that of MG/SR (2 × 107 Ω·cm). The development of BN−MG/SR composites with synergetic properties of high thermal conductivity and satisfactory electrical insulation is supposed to be a promising candidate for practical application in the electronic packaging field. [ABSTRACT FROM AUTHOR]

The high-quality, high-efficiency micro-hole drilling of structural ceramics to improve the thermal conductivity of hot-end parts or achieve high-density electronic packaging is still a technical challenge for conventional processing techniques. Recently, the laser drilling method (LDM) has become the preferred processing tool for structural ceramics, and it plays an irreplaceable role in the industrialized processing of group holes on structural ceramic surfaces. A variety of LDMs such as long pulsed laser drilling, short pulsed laser drilling, ultrafast pulsed laser drilling, liquid-assisted laser drilling, combined pulse laser drilling have been developed to achieved high-quality and high-efficiency micro-hole drilling through controlling the laser–matter interaction. This article reviews the characteristics of different LDMs and systematically compares the morphology, diameter, circularity, taper angle, cross-section, heat affect zone, recast layer, cracks, roughness, micro–nano structure, photothermal effect and photochemical reaction of the drilling. Additionally, exactly what processing parameters and ambient environments are optimal for precise and efficient laser drilling and their recent advancements were analyzed. Finally, a summary and outlook of the LDM technology are also highlighted. [ABSTRACT FROM AUTHOR]

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging. [ABSTRACT FROM AUTHOR]