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In this paper, a microelectromechanical system (MEMS) cantilever sensor was designed, modeled and fabricated to measure the terahertz (THz) radiation induced photoacoustic (PA) response of gases under low vacuum conditions. This work vastly improves cantilever sensitivity over previous efforts, by reducing internal beam stresses, minimizing out of plane beam curvature and optimizing beam damping. In addition, fabrication yield was improved by approximately 50% by filleting the cantilever's anchor and free end to help reduce high stress areas that occurred during device fabrication and processing. All of the cantilever sensors were fabricated using silicon-on-insulator (SOI) wafers and tested in a custom built, low-volume, vacuum chamber. The resulting cantilever sensors exhibited improved signal to noise ratios, sensitivities and normalized noise equivalent absorption (NNEA) coefficients of approximately 4.28 x 10-10 cm-1. WHz-1/2. This reported NNEA represents approximately a 70% improvement over previously fabricated and tested SOI cantilever sensors for THz PA spectroscopy. [ABSTRACT FROM AUTHOR]

In this paper we present and discuss two innovative liquid-free SOI sensors for pressure measurements in harsh environments. The sensors are capable of measuring pressures at high temperatures. In both concepts media separation is realized using a steel membrane. The two concepts represent two different strategies for packaging of devices for use in harsh environments and at high temperatures. The first one is a "one-sensor-one-packaging_technology" concept. The second one uses a standard flip-chip bonding technique. The first sensor is a "floating-concept", capable of measuring pressures at temperatures up to 400 °C (constant load) with an accuracy of 0.25% Full Scale Output (FSO). A push rod (mounted onto the steel membrane) transfers the applied pressure directly to the center-boss membrane of the SOI-chip, which is placed on a ceramic carrier. The chip membrane is realized by Deep Reactive Ion Etching (DRIE or Bosch Process). A novel propertied chip housing employing a sliding sensor chip that is fixed during packaging by mechanical preloading via the push rod is used, thereby avoiding chip movement, and ensuring optimal push rod load transmission. The second sensor can be used up to 350 °C. The SOI chips consists of a beam with an integrated centre-boss with was realized using KOH structuring and DRIE. The SOI chip is not "floating" but bonded by using flip-chip technology. The fabricated SOI sensor chip has a bridge resistance of 3250 Ω. The realized sensor chip has a sensitivity of 18 mV/µm measured using a bridge current of 1 mA. [ABSTRACT FROM AUTHOR]

In this paper, an adaptive, autocovariance-based event detection algorithm is proposed, which can be used with micro-electro-mechanical systems (MEMS) accelerometer sensors to build inexpensive and power efficient event detectors. The algorithm works well with low signal-to-noise ratio input signals, and its computational complexity is very low, allowing its utilization on inexpensive low-end embedded sensor devices. The proposed algorithm decreases its energy consumption by lowering its duty cycle, as much as the event to be detected allows it. The performance of the algorithm is tested and compared to the conventional filter-based approach. The comparison was performed in an application where illegal entering of vehicles into restricted areas was detected. [ABSTRACT FROM AUTHOR]

This paper reports on a microelectromechanical systems (MEMS)-based sensor for pulse wave measurement. The sensor consists of an air chamber with a thin membrane and a 300-nm thick piezoresistive cantilever placed inside the chamber. When the membrane of the chamber is in contact with the skin above a vessel of a subject, the pulse wave of the subject causes the membrane to deform, leading to a change in the chamber pressure. This pressure change results in bending of the cantilever and change in the resistance of the cantilever, hence the pulse wave of the subject can be measured by monitoring the resistance of the cantilever. In this paper, we report the sensor design and fabrication, and demonstrate the measurement of the pulse wave using the fabricated sensor. Finally, measurement of the pulse wave velocity (PWV) is demonstrated by simultaneously measuring pulse waves at two points using the two fabricated sensor devices. Furthermore, the effect of breath holding on PWV is investigated. We showed that the proposed sensor can be used to continuously measure the PWV for each pulse, which indicates the possibility of using the sensor for continuous blood pressure measurement. [ABSTRACT FROM AUTHOR]

Continuously monitoring the operation of each individual fan can significantly improve the measurement quality of aerial pollutant emissions from animal buildings that have a large number of fans. To monitor the fan operation by detecting the fan vibration is a relatively new technique. A low-cost electronic vibration sensor was developed and commercialized. However, its large scale application has not yet been evaluated. This paper presents long-term performance results of this vibration sensor at two large commercial layer houses. Vibration sensors were installed on 164 fans of 130 cm diameter to continuously monitor the fan on/off status for two years. The performance of the vibration sensors was compared with fan rotational speed (FRS) sensors. The vibration sensors exhibited quick response and high sensitivity to fan operations and therefore satisfied the general requirements of air quality research. The study proved that detecting fan vibration was an effective method to monitor the on/off status of a large number of single-speed fans. The vibration sensor itself was $2 more expensive than a magnetic proximity FRS sensor but the overall cost including installation and data acquisition hardware was $77 less expensive than the FRS sensor. A total of nine vibration sensors failed during the study and the failure rate was related to the batches of product. A few sensors also exhibited unsteady sensitivity. As a new product, the quality of the sensor should be improved to make it more reliable and acceptable. [ABSTRACT FROM AUTHOR]

This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly. [ABSTRACT FROM AUTHOR]

A bulk micromachined inertial measurement unit (MIMU) is presented in this paper. Three single-axis accelerometers and three single-axis gyroscopes were simultaneously fabricated on a silicon wafer using a bulk micromachining process; the wafer is smaller than one square centimeter. In particular, a global area optimization method based on the relationship between the sensitivity and layout area was proposed to determine the layout configuration of the six sensors. The scale factors of the X/Y-axis accelerometer and Z-axis accelerometer are about 213.3 mV/g and 226.9 mV/g, respectively. The scale factors of the X/Y-axis gyroscope and Z-axis gyroscope are about 2.2 mV/°/s and 10.8 mV/°/s, respectively. The bias stability of the X/Y-axis gyroscope and the Z-axis gyroscope are about 2135 deg/h and 80 deg/h, respectively. Finally, the resolutions of X/Yaxis accelerometers, Z-axis accelerometers, X/Y-axis gyroscopes, and Z-axis gyroscopes are 0.0012 g/ √Hz , 0.0011 g/ √Hz , 0.314 ° /s/ √Hz , and 0.008 ° /s/ √Hz , respectively. [ABSTRACT FROM AUTHOR]