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The Cassie–Baxter state of wetting explains a large equilibrium contact angle and the slippery dynamics of a water droplet on a superhydrophobic rough surface. It also causes a contact angle hysteresis (CAH) that cannot be fully described by dynamic wetting theories including the molecular kinetic theory (MKT). We analyze the contact line dynamics on a superhydrophobic surface in the framework of the MKT. Multi-body dissipative particle dynamics simulations of a capillary bridge confined between two rough surfaces under steady shear are performed. We find that, in addition to the contact line friction force from the MKT, an additional friction force contribution is needed on rough surfaces. It can be obtained by subtracting from the total friction force the force solely caused by the actual liquid–solid contact area. We find that the additional force is almost constant at all contact line velocities. Thus, it is directly related to the CAH. The CAH originates not only from contact line pinning but also from the shear flow due to the strong friction in the central region of the liquid–solid interface away from the contact line. The analysis of the particle flow inside the capillary bridge shows that liquid particles trapped in the grooves of the surface texture actually move with the same velocity as the surface and exert strong additional friction to other liquid particles. This work extends the MKT to rough surfaces, as well as to elucidate the origin of the CAH of a capillary bridge. The finding would help to better understand other situations of dynamic wetting on superhydrophobic surfaces. [ABSTRACT FROM AUTHOR]

In wafer polishing pad surface plays a crucial role in the polishing process. With the increase of friction time between pad and wafer, the pad becomes flattened or glazed with particles clogging the pores of the pad and forming a layer of slurry residue and wafer particles, leading to changes of COF, material removal rates and higher defects on the wafer surface. Thus, this study aims to determine the correlation between pad surface deformation, slurry adhesive rate and Coefficient of friction (COF) during friction between felt pad and single -crystal silicon, to analyze the relationship between pad condition and COF. The real-time COF between felt pad and single-crystal silicon wafer are tested which are sorted in groups depending on various loads and oscillation frequencies and surfaces of felt pads measuring by Scanning electron microscope (SEM) are compared. The correlation between pad surface deformation and abrasive adhesion and COF is evaluated through analyzing the experiment results. [ABSTRACT FROM AUTHOR]