1. Interconnect models curb chip power.
- Author
-
Mokhoff, Nicolas
- Subjects
- *
CONFERENCES & conventions , *INTEGRATED circuit interconnections , *INTEGRATED circuits conferences , *TECHNICAL writing , *INFORMATION technology - Abstract
The article reports on the two technical papers presented at the recent International Interconnects Technology Conference in San Francisco, California. The papers indicated the semiconductor researchers' power-saving techniques as they scale chips to smaller sizes. Researchers from Intel Corp. showed direction on how to optimize repeater and logic transistor technologies, as well as improving repeater insertion methods and applying three-dimensional integration. Another paper from Georgia Institute of Technology suggested the use of carbon nanotubes to address some of the challenges of gigascale-integration interconnects.
- Published
- 2006