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Low weight, small footprint, and high performances are essential requisites for the implementation of energy storage devices within consumer electronics. One way to achieve these goals is to increase the thickness of the active material layer. In this work, carbonized and graphitized rayon felt, a cellulose‐derived material, is used as a three‐dimensional current collector scaffold to enable the incorporation of large amount of active energy storage materials and ionic liquid‐based gel electrolyte in the supercapacitor devices. PEDOT:PSS, alone or in combination with active carbon, has been used as the active material. Three‐dimensional supercapacitors with high per unit area capacitance (more than 1.1 F/cm2) have been achieved owing to the loading of large amount of active material in the felt matrix. Areal energy density of more than 101 μWh/cm2 and areal power density of more than 5.9 mW/cm2 have been achieved for 0.8 V operating voltage at a current density of 1 mA/cm2. A nanographite material was found to be beneficial in reducing the internal serial resistance of the supercapacitor to lower than 1.7 Ω. Furthermore, it was shown that even after 2000 times cycling test, the devices could still retain its performance with at least 88% coulombic efficiency for all the devices. All the materials are readily available commercially, environmentally sustainable and the process can potentially be upscaled with industrial process. [ABSTRACT FROM AUTHOR]

Ultrathin devices are rapidly developing for skin‐compatible medical applications and wearable electronics. Powering skin‐interfaced electronics requires thin and lightweight energy storage devices, where solution‐processing enables scalable fabrication. To attain such devices, a sequential deposition is employed to achieve all spray‐coated symmetric microsupercapacitors (μSCs) on ultrathin parylene C substrates, where both electrode and gel electrolyte are based on the cheap and abundant biopolymer, cellulose. The optimized spraying procedure allows an overall device thickness of ≈11 µm to be obtained with a 40% active material volume fraction and a resulting volumetric capacitance of 7 F cm−3. Long‐term operation capability (90% of capacitance retention after 104 cycles) and mechanical robustness are achieved (1000 cycles, capacitance retention of 98%) under extreme bending (rolling) conditions. Finite element analysis is utilized to simulate stresses and strains in real‐sized μSCs under different bending conditions. Moreover, an organic electrochromic display is printed and powered with two serially connected μ‐SCs as an example of a wearable, skin‐integrated, fully organic electronic application. [ABSTRACT FROM AUTHOR]

Advances in organic electronics necessitates, ultrathin and miniaturized implantable energy storage modules. Here, an approach for the fabrication of on-chip, ultraflexible electrochemical capacitors is demonstrated. Two different electroactive conjugated polymers are utilized in a fabrication route that allows the patterning of finger electrodes for an ultraflexible energy storage technology. A strategy is demonstrated to realize supercapacitors with a total device thickness of 4 μm, including substrate, polymer electrode, and electrolyte. Interdigitated 20-finger electrodes from either Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) or polythiophene functionalized with tetraethylene glycol side chains P(g42T-T), with 50 μm or 90 μm electrode spacings, are fabricated using a parylene peel off method, followed by electrolyte deposition. The miniaturized devices show 0.77 mF/cm2 areal capacitance for PEDOT:PSS and 0.06 mF/cm2 for P(g42T-T). Furthermore, the devices exhibit excellent mechanical durability, showing robust operational performance at a bending radius of 6.5 mm. [Display omitted] • Scalable fabrication route for polymer IDE structures using parylene peel off method. • PEDOT:PSS and P(g42T-T) microsupercapacitors with more than 0.6 mF/cm2 capacitance. • Ultrathin organic electronics device technology with total thickness of 4 μm. • Excellent mechanical durability, showing robust operational performance at a bending radius of 6.5 mm. [ABSTRACT FROM AUTHOR]