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Accurate measurement of the junction temperature Tj is crucial for ensuring safe operation and evaluating the performance of silicon carbide (SiC) metal–oxide–semiconductor field-effect transistors (MOSFETs). In this paper, the junction temperature of a half-bridge is monitored by combining transient voltage and current peaks across the lower device. Both theoretical analysis and switch tests validate that the peak induced voltage and peak reversed current during the commutation transient exhibit a linear relationship with the temperature of the corresponding devices. The impact of load current and bus voltage on the measurement results is also investigated. Moreover, the effectiveness of the proposed method is confirmed by carrying out tests at different temperatures, and the feasibility of online implementation is discussed. The experimental results show that the proposed method has high linearity and sensitivity and can simultaneously provide temperature information for both devices of a half-bridge. [ABSTRACT FROM AUTHOR]

This letter proposes an indirect power dissipation level short circuit protection (IPDL-SCP) method for silicon carbide (SiC) metal-oxide semiconductor field-effect transistors (mosfets). Due to differences between normal conducting and short-circuit (SC) conditions, this method is triggered by the voltage oscillation vss at the parasitic inductance (Lss) of the source and directly monitoring vds of SiC mosfet. For verification, the short circuit protection circuit is tested and proved functional on the SC test bench. Experimental results show that the protection circuit can respond to both hard switching fault (HSF) and fault under load (FUL), while the fastest response delays are 75 ns for HSF and 170 ns for FUL. Comparisons with other commonly used SC protection methods have also been made, which show that the proposed IPDL-SCP method has better performance in shorter protection delays. [ABSTRACT FROM AUTHOR]