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The influence of Si, Cu, B, and trace alloying elements on the conductivity of aluminum die cast 12 (ADC12) alloy was investigated. The conductivity decreased linearly with increasing volume fraction of the Si phase attributed to a linear decrease of the volume of the more conductive Al phase through a rule of mixtures. The conductivity also decreased with increasing Cu content, between 0~3%. The conductivity increased with increasing B content, reached the peak at 0.02% B and thereafter decreased somewhat. The mechanism was that B reacted with the transition element in the Al phase to form boride, decreasing the transition element concentration in the Al lattice, and decreasing the lattice constant. The thermal conductivity, λ, was related to the electrical conductivity, σ , by means of λ = LT σ + λ g , where L is the apparent Lorentz constant, 1.86 × 10−8; T is the absolute temperature, 293 K; λg is the lattice conductivity, 42.3 W/(m·K). [ABSTRACT FROM AUTHOR]

In recent years, phase change materials (PCMs) have been widely used in waste heat utilization, buildings, and solar and wind energy, but with a huge limitation from the low thermal conductivity, photothermal conversion efficiency, and low latent heat. Organic PCMs are eyecatching because of its high latent heat storage capability and reliability, but they still suffer from a lack of photothermal conversion and sharp stability. Here, we prepared sharp-stable PCMs by establishing a carbon material frame system consisting of graphene oxide (GO) and biochar. In particular, surfactants (CTAB, KH-560 and KH-570) were employed to improve the dispersity of GO in PEG. The differential scanning calorimetry results shows that the latent heat of PEG modified by CTAB grafted GO (PGO-CTAB) was the highest (191.36 J/g) and increased by 18.31% compared to that of pure PEG (161.74 J/g). After encapsulation of PGO-CTAB in biochar, the obtained composite PCM with the amount of biochar and PGO-CTAB in weight ratio 4:6 (PGO-CTAB/CS6(6)) possesses relatively high latent heat 106.51 J/g with good leak resistance and thermal stability, and with obviously enhanced thermal conductivity (0.337 W/(m·K)) and photothermal conversion efficiency (77.43%), which were higher than that of PEG6000 (0.325 W/(m·K), 44.63%). The enhancement mechanism of heat transfer and photothermal conversion on the composite PCM is discussed. [ABSTRACT FROM AUTHOR]

Vertically aligned carbon nanotube (CNT) arrays are promising candidates for advanced thermal interface materials (TIMs) since they possess high mechanical compliance and high intrinsic thermal conductivity. Some of the previous works indicate that the CNT arrays in direct dry contact with the target surface possess low contact thermal conductance, which is the dominant thermal resistance. Using a phase sensitive transient thermo-reflectance (PSTTR) technique, we measure the thermal conductance between CNT arrays and copper (Cu) surfaces under different pressures. The experiments demonstrated that the contact force is one of the crucial factors for optimizing the thermal performance of CNT array-based TIMs. The experimental results suggest that the Cu-CNT arrays' contact thermal conductance has a strong dependence on the surface deformation and has an order of magnitude rise as the contact pressure increases from 0.05 to 0.15 MPa. However, further increase of the contact pressure beyond 0.15 MPa has little effect on the contact thermal resistance. This work could provide guidelines to determine the minimum requirement of packaging pressure on CNT TIMs. [ABSTRACT FROM AUTHOR]