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Abstract: A new micromachining method for the fabrication of micro-metal structures by using micro-reversible electrical discharge machining (EDM) was investigated. The reversible machining combines the micro-EDM deposition process with the selective removal process, which provides the ability of depositing or removing metal material using the same micro-EDM machining system. From the discharge mechanism of micro-EDM, the process conditions of micro-EDM deposition were analyzed firstly. Using the brass and steel materials as a tool electrode, the micro-cylinders with 200μm in diameter and height-to-diameter ratio of more than 5 were deposited on a high-speed steel surface. Then the machining procedure was transformed easily from deposition to selective removal process by switching the process conditions. Different removal strategies including micro-EDM drilling and micro-EDM milling were used in the machining. Micro-holes with 80μm in diameter are drilled successfully in the radial direction of the deposited micro-steel cylinder. Also, a brass square column with 70μm in side length and 750μm in height, and a micro-cylinder with 135μm in diameter and 1445μm in height are obtained by using micro-EDM milling. Finally, the characteristics of the deposited material were analyzed. The results show that the material components of a deposited micro-cylinder are almost the same as those of the tool electrode, and the metallurgical bonding has been formed on the interface. In addition, the Vickers-hardness of 454Hv of the steel deposited material is higher when compared to the hardness of 200Hv of the raw steel electrode. [Copyright &y& Elsevier]

Tool electrode wear varying with different materials in electrical discharge machining (EDM) is unavoidable, thus inevitably reducing the machining quality and accuracy of microstructures. To convert this disadvantageous phenomenon into a beneficial process, the paper proposed a wear-variation EDM (WV-EDM) approach to fabricate a laminated disc electrode (LDE) with stable-shape micro channels on the outer edge surface; this electrode was subsequently used to machine micro grooves on workpieces by EDM. The WV-EDM formation of the LDE, the relationship between relative volume wear rate of the disc foils and the machining depth, and flow field distribution in the machining gap of the LDE during processing were investigated. The results show that the method proposed herein could reliably produce LDEs with stable micro channels on the outer edge surfaces that could subsequently be employed to continuously machine micro groove arrays with the same machining depth on the same material workpiece by EDM, and especially LDE reshaping was unnecessary. Additionally, the "pump effect" of the vortex, located in the flow field between micro channels on the LDE and workpiece, was beneficial for debris removal. Using the proposed method, micro groove arrays and columnar microstructures were successfully fabricated on Ti–6Al–4V alloy workpieces. [ABSTRACT FROM AUTHOR]

Glass hot embossing is a well-established and cost-effective manufacturing method for glass microstructures. However, the spatial volume affects deformation behaviors in closed mold cavities, which determines the final shape of the embossed glass. To investigate the spatial gas effect on the glass deformation mechanism during hot embossing, we used the focused ion beam (FIB) to fabricate blind micro-hole array structures with different depths as embossing templates. The experimental results demonstrated that the spatial volume of the mold cavity has a great influence on the energy of gas expansion, thus affecting the deformation height of glass microstructures during hot embossing. The deeper the cavity depth, the bigger the surface tension, resulting in larger surface concave deformation. Due to the surface tension of gas expansion, the deformation height of the edge zone is higher than that of the center zone at a higher embossing temperature until the heated glass is completely compressed into the mold cavity. Additionally, at lower embossing temperatures (520 °C), the heated glass has a large deformation resistance and elastic recovery. The more deformation volume escape from the shallower mold cavity because of the spatial effect, thus the deformation height decreases as the cavity depth reduces. The work provides a better understanding of manufacturing glass microstructures in hot embossing. [ABSTRACT FROM AUTHOR]

The size effects in metal forming have been found to be crucial in micro-scale plastic deformation or micro-forming processes, which lead to attenuation of the material's formability due to the increasing heterogeneity of the plastic flow. The use of an electric field during micro-scale plastic deformation has shown to relieve size effects, enhance the material's formability, modify the microstructure, etc. Consequently, these electric-assisted (EA) micro-forming processes seem to bring many potential benefits that need to be investigated. Accordingly, here we investigated the influence of an electric field on the size effects to describe the fracture behavior in uniaxial micro-tension tests of an AZ31 alloy with various grain sizes. In order to decouple the thermal-mechanical and microstructure changes, room temperature (RT), oven-heated (OH), air-cooled (AC), and EA uniaxial micro-tension tests were conducted. The size effects contribution on the fracture stress and strain showed a similar trend in all the testing configurations. However, the smallest fracture stresses and the largest fracture strains were denoted in the EA configuration. EBSD examination shows that current-induced dynamic recrystallization (DRX) and texture evolution could be negligible under the studied conditions. The kernel average misorientation (KAM) maps give the larger plastic deformation in the EA specimens due to the reduction of plastic micro-heterogeneity. Finally, the fracture morphology indicates that the current-induced ductility enhancement may be attributed to the arrest of micro-crack propagation and the inhibition of void initiation, growth, and coalescence caused by lattice melting and expansion. [ABSTRACT FROM AUTHOR]