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With ever-increasing transistor density in nanoscale-integrated circuits, the impact of process variations on circuit performance and chip yield becomes dominant. To prevent failures in the field, simulation-based circuit optimization tools are performed during design time as a countermeasure. However, the efficiency of these tools requires accurate modeling of failure probabilities. Especially, for high-sigma problems such as yield estimation of memory cells, which require very high production yield, the failure rate assessment must be highly accurate. Importance sampling (IS) methods are deployed in this context to uncover very rare failure events, which cannot be revealed by standard Monte Carlo methods. Besides a highly accurate yield prediction model, the limited time budget of the simulation-based analysis tools has to be taken into account. Especially in conjunction with yield optimization techniques, the required number of circuit simulations for the failure rate estimation has to be substantially reduced. In this article, we propose a yield optimization method, which is based on a Bayesian optimization (BO) failure rate estimation technique for high-sigma yield extraction. The BO-based IS method is combined with a kernel density estimator for finding the most probable failure events, which have significant contribution to the chip yield. By integration into a global optimization framework, we show how the proposed yield optimization method can be applied to high-sigma yield optimization problems, such as memory cells. The experimental results indicate that the proposed method consumes only 5% circuit simulations to achieve the same optimization effect as the state-of-the-art yield optimizer techniques. [ABSTRACT FROM AUTHOR]

Emerging applications in soft robotics, wearables, smart consumer products or IoT-devices benefit from soft materials, flexible substrates in conjunction with electronic functionality. Due to high production costs and conformity restrictions, rigid silicon technologies do not meet application requirements in these new domains. However, whenever signal processing becomes too comprehensive, silicon technology must be used for the high-performance computing unit. At the same time, designing everything in flexible or printed electronics using conventional digital logic is not feasible yet due to the limitations of printed technologies in terms of performance, power and integration density. We propose to rather use the strengths of neuromorphic computing architectures consisting in their homogeneous topologies, few building blocks and analog signal processing to be mapped to an inkjet-printed hardware architecture. It has remained a challenge to demonstrate non-linear elements besides weighted aggregation. We demonstrate in this work printed hardware building blocks such as inverter-based comprehensive weight representation and resistive crossbars as well as printed transistor-based activation functions. In addition, we present a learning algorithm developed to train the proposed printed NCS architecture based on specific requirements and constraints of the technology. [ABSTRACT FROM AUTHOR]

In many application domains, in particular automotives, guaranteeing a very low failure rate is crucial to meet functional and safety standards. Especially, reliable operation of memory components such as SRAM cells is of essential importance. Due to aggressive technology downscaling, process and runtime variations significantly impact manufacturing yield as well as functionality. For this reason, a thorough memory failure rate assessment is imperative for correct circuit operation and yield improvement. In this regard, Monte Carlo (MC) simulations have been used as the conventional method to estimate the variability induced failure rate of memory components. However, MC methods become infeasible when estimating rare events such as high-sigma failure rates. To this end, importance sampling (IS) methods have been proposed which reduce the number of required simulations substantially. However, existing methods still suffer from inaccuracies and high computational efforts, in particular for high-sigma problems. In this article, we fill this gap by presenting an efficient mixture IS approach based on Bayesian optimization, which deploys a surface model of the objective function to find the most probable failure points. Its advantages include constant complexity independent of the dimensions of design space, the potential to find the global extrema, and the higher trustworthiness of the estimated failure rate by accurately exploring the design space. The approach is evaluated on a 6T-SRAM cell as well as a master–slave latch based on a 28-nm FDSOI process. The results show an improvement in accuracy, resulting in up to 63 × better accuracy in estimating failure rates compared to the best state-of-the-art solutions on a 28-nm technology node. [ABSTRACT FROM AUTHOR]

Electrolyte-gated field-effect transistor technology is an attractive candidate for printed low-power electronics due to its high field-effect mobility and extremely low-voltage operation. Relying on an additive process, inkjet-printed devices display large process variations due to ink-substrate interactions, sensitivity to environmental conditions, such as temperature and humidity, as well as intrinsic variations of the ink. All of these sources of variations may display themselves in non-Gaussian distributions as suggested by our experiments. In this paper, we therefore propose a generic methodology for variability modeling of printed transistors, based on the Gaussian mixture model, which can be used to model any arbitrary distribution of the transistor model parameters. The proposed methodology was tested on two different data sets and has been used to predict the behavior of a measured printed security circuit as well as transistor dc characteristics. [ABSTRACT FROM AUTHOR]

Electrolyte-gated, printed field-effect transistors exhibit high charge carrier densities in the channel and thus high on-currents at low operating voltages, allowing for the low-power operation of such devices. This behavior is due to the high area-specific capacitance of the device, in which the electrolyte takes the role of the dielectric layer of classical architectures. In this paper, we investigate intrinsic double-layer capacitances of ink-jet printed electrolyte-gated inorganic field-effect transistors in both in-plane and top-gate architectures by means of voltage-dependent impedance spectroscopy. By comparison with deembedding structures, we separate the intrinsic properties of the double-layer capacitance at the transistor channel from parasitic effects and deduce accurate estimates for the double-layer capacitance based on an equivalent circuit fitting. Based on these results, we have performed simulations of the electrolyte cutoff frequency as a function of electrolyte and gate resistances, showing that the top-gate architecture has the potential to reach the kilohertz regime with proper optimization of materials and printing process. Our findings additionally enable accurate modeling of the frequency-dependent capacitance of electrolyte/ion gel-gated devices as required in the small-signal analysis in the circuit simulation. [ABSTRACT FROM AUTHOR]