1. Analysis of grinding fluid flow in high-temperature alloy surface profile grinding.
- Author
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Ji, Tian, Huang, Shengli, Ren, Boming, Ye, Jiuzhen, and Wang, Gaowei
- Subjects
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FLUID flow , *DYNAMIC pressure , *ALLOYS , *GRINDING wheels , *TWO-phase flow , *FLUID pressure , *MECHANICAL abrasion - Abstract
The flow conditions of the grinding fluid during grinding are analyzed with regard to the problem of easy burns during surface profile grinding of difficult-to-machine materials, nickel-based high-temperature alloys. The CFD simulations were carried out to analyze the grinding fluid flow in the grinding zone during flat and circular profile grinding according to the gas–liquid two-phase flow VOF theory. Numerical simulations were performed using FLUENT software to analyze the pressure and volume fraction in the gas–liquid two-phase flow field under different parameters by changing the injection speed and injection position. The effects of different injection positions and injection speeds on the grinding fluid flow in the grinding zone were investigated. The study showed that the higher the injection speed of the grinding fluid, the higher the dynamic pressure of the grinding fluid on the workpiece surface and the higher the return flow rate on the grinding wheel surface; the lower the speed, the lower the dynamic pressure of the grinding fluid on the workpiece surface but the higher the return flow rate. At the same injection position, the volume fraction of grinding fluid flowing from the outlet first increases with increasing injection speed, and then tends to level off; at the same injection speed, the integral number of grinding fluid flowing from the outlet is greatest for the central injection. Thus, the optimal injection position and injection speed of grinding fluid are proposed. It provides an important reference for improving the quality of profile grinding and preventing the workpiece from being burned during grinding, and provides a basis for subsequent profile grinding tests on high-temperature alloys. [ABSTRACT FROM AUTHOR]
- Published
- 2023
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