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Graphite-based metal transition-layer substrates hold great potential for preparing large-area diamond films and achieving crack-free release. In this study, a five-inch crack-free free-standing diamond film was prepared on a graphite substrate with a sacrificial Mo/Ti double-layer transition layer using direct-current arc plasma jet chemical vapor deposition (DC jet CVD). The interfacial bonding and diffusion behavior between the diamond and the transition layers were investigated. The effect of abundant metal particles and elemental diffusion between layers on film adhesion and stress release are discussed and analyzed. The surface of Ti layer prepared by the multi-arc ion-plating contains numerous metal particles that provide a template for the fine-crystalline Mo layer. Metal particles are encapsulated and embedded in the diamond and act as anchors that ensure the stability of the substrate–diamond bond during high-temperature deposition. After deposition, those metal particles act as weak points and play crucial stress-release roles. Mutual elemental diffusion occurs between the Ti, Mo, and diamond layers. Ti penetrates the Mo layer to form a continuous 140-nm-thick thin layer during the initial deposition period, facilitating diamond nucleation. Carbon from the plasma and diamond diffuses into the metal transition layer. Thermal stress generated between the diamond and the graphite substrate is released by destroying the metal transition layer with high thermal expansion coefficient and low elastic modulus during cooling from the deposition temperature. Cracks rapidly propagate along the interface between destroyable transition layers and graphite substrate, which results in the liftoff of a fully crack-free diamond film. [Display omitted] [ABSTRACT FROM AUTHOR]

The direct-current arc plasma jet method is advantageous for the rapid deposition of large-area self-supporting diamond films. However, dark defects tend to be generated during the growth process, significantly affecting the performance of the diamond. In this study, we use the direct-current arc plasma jet method to prepare transparent and translucent samples. Subsequently, we compare their optical, thermal, and mechanical properties and analyze the differences in their performances via microstructure and defect analyses. The results indicate that the transparent diamond samples exhibit excellent optical and thermal properties, with a transmittance of 68.4 % at a wavelength of 10.6 μm and a thermal conductivity similar to that of type-IIa single crystal diamond (i.e. 2002 W/(m·K)). Meanwhile, the translucent diamond exhibits outstanding mechanical properties, with a fracture strength of 984 MPa. Characterization results based on electron backscatter diffraction and X-ray computed tomography suggest that a preferred orientation along the (220) planes is conducive to the densification growth of the samples, thereby enhancing their optical and thermal properties. However, the generation of numerous twins results in interlocking between grains, which improves sample's mechanical properties but introduces porosity and impurities, thus deteriorating its optical and thermal performance. [Display omitted] • Optical and thermal diamond films were deposited by DC-arc plasma jet CVD with growth rates >6 μm/h. • Strong (220) texture and numerous twins can improve optical transmittance and fracture strength, respectively. • X-ray CT was used to reveal defects distribution and content within diamond samples. [ABSTRACT FROM AUTHOR]

Diamond is a highly attractive material for many applications in material science, engineering, chemistry, and biology because of its favorable properties. The preparation of large-area freestanding diamond plate can greatly reduce the production cost of diamond and promote the industrialization of diamond. In this study, the dual-magnetic field mode was introduced to optimize the magnetic field distribution in direct current arc plasma jet chemical vapor deposition (DC Jet CVD) system, and the arc plasma was effectively controlled under the coupling of electric field and magnetic field. The uniformity of the plasma distribution above the substrate surface is significantly improved, resulting in long-term stable and uniform growth of the 8-inch freestanding diamond plate. The influence of dual-magnetic field mode on magnetic field generation, arc feature, and reactive group distribution was studied. 8-inch freestanding diamond plates with an average thickness of 2.8 mm were prepared by dual-magnetic controlled DC Jet CVD. The results showed that the 8-inch diamond plate preferred a high (220) orientation, and the deviation of thickness of which was around 10 % of the averaged values. Raman spectroscopy of diamond revealed a 6.6 cm−1 of full width at half maximum (FWHM) and calculated 1.20 GPa compressive stress in the 8-inch diamond plate. By means of mechanical and thermal property measurements, the large area diamond plate shows a robust structure with the average values of three-point bending fracture strength of 987.2 MPa, and extremely high thermal conductivity of 1797.8 W/(m·k) as well. The deviation of three-point bending fracture strength and the thermal conductivity over the 8-inch diamond plate was around 7.9 % and 12.6 % of the respective averaged values. [Display omitted] • A uniform and robust 8-inch diamond plate was prepared using a dual-field DC arc CVD system. • The average three-point bending fracture strength of the 8-inch diamond plate was 987.23 MPa, and the average thermal conductivity was 1797.80 W/(m•K). • The effect of dual magnetic field mode on the distribution of arc morphology and arc plasma groups was analyzed using a high-speed camera and filter. [ABSTRACT FROM AUTHOR]

In this study, standard diamond bars were prepared using an ultra-thick diamond plate, and the bars had sizes consistent with the International Organization for Standardization (ISO) 14704:2016(E) three-point bending method for measuring the fracture strength. Ultra-thick diamond plate with dimensions of 125 mm (diameter) × 6.5 mm (thickness) were deposited using direct current arc plasma jet chemical vapour deposition. After cutting, grinding, and polishing, 12 diamond bars meeting the requirements of the ISO standard were prepared (36 mm × 4 mm × 3 mm) and tested for fracture strength using the cited ISO standard and elastic modulus using deflection measurements. The fracture strength of the ultra-thick diamond plate was found to be 580 ± 66 MPa. In addition, for comparison, the fracture strengths of standard ZnS, sapphire, and alumina were also analysed. Crucially, this is the first report of the fracture strength of standard-sized diamond plate. The effects of the defects and grain size on the crack formation and failure of the diamond film were analysed. The diamond's fracture strength was affected by the sample thickness, which caused the gradual accumulation of defects as this dimension increased, but not by its length and width. The elastic moduli of sapphire and alumina were compared. Overall, the measurement of the fracture strengths of ultra-thick diamond plate via the ISO standard is important for industrial applications. [ABSTRACT FROM AUTHOR]

Here, thermal stabilities for Ohmic contact properties of Pt, Au, and Pd on the same hydrogen-terminated diamond (H-diamond) epitaxial layer are investigated. A long-term annealing process is performed with an annealing temperature and time of 400 °C and 8 h, respectively. Before annealing, good Ohmic contact properties are observed for only two contacts of the Pt/H-diamond and Pd/H-diamond with specific contact resistivity (ρC) values of 2.7 × 10−3 Ω cm2 and 2.6 × 10−4 Ω cm2, respectively. After long-term annealing, all three contacts on the H-diamond show good Ohmic contact properties. The ρC values for the Pt/H-diamond and Au/H-diamond are 3.1 × 10−2 Ω cm2 and 4.2 × 10−4 Ω cm2, respectively. They are higher than that of the Pd/H-diamond (1.1 × 10−4 Ω cm2). Therefore, low ρC and good thermal stability for the Pd/H-diamond are achieved. This is meaningful for pushing forward the development of H-diamond-based electronic devices for high-temperature applications. [ABSTRACT FROM AUTHOR]

In this study, the effect of defects on fracture toughness in different directions was investigated. Two diamond films with a diameter of 122 mm and as-deposited thicknesses of 2.2 and 1.5 mm, respectively, were deposited by DC arc plasma jet chemical vapor deposition. To accurately obtain the fracture toughness, the films were ground and polished to 1.6 and 0.8 mm, respectively. The results indicate that many defects, including pores, are introduced into the films during the growth process, particularly on the side close to the growth surface in thicker film. The size of pores reaches micrometres, which affects the fracture toughness under loading in different directions. Due to the minimum grain size, both films exhibit a maximum toughness of 8.2 and 10.0 MPa·m1/2, respectively, with growth-surface cracks. For the thinner sample, the maximum value is followed by that of the edge-surface cracks. As the grain size of the edge surface falls between that of the growth surface and that of the nucleation surface, the results indicate that fracture toughness is affected by grain size. However, the number of pores near the growth side increases when the thickness exceeds 0.8 mm. Pores reduce the toughness, resulting in the minimum fracture toughness (6 MPa·m1/2) of the thicker diamond film with edge-surface laser cracks. The sample with an edge-surface sharp pre-crack has a similar fracture toughness of 5.6 MPa·m1/2. This study provides guidance for selecting the applied load direction. • Two thick diamond films with thicknesses 2.18 and 1.48 mm were deposited. • Fracture toughnesses of the diamond films in three directions were investigated. • Numerous pores were formed in the diamond films during orientation growth. • Due to the effect of pores, the toughness values among three directions differ. [ABSTRACT FROM AUTHOR]

Diamond has attracted increasing attention because it has high thermal conductive. Here, a freestanding diamond thermal conductive film with a diameter of about 7 in. and an average thickness of 1.54 mm was prepared by DC arc plasma jet CVD with multi-stage magnetic fields. Specifically, the thickness uniformity was ensured by adding the magnetic field during the deposition of the freestanding diamond film. The morphology, structure and thermal conductivity of the diamond film were studied. The results showed that the expansion area of the DC arc plasma approached the surface of the substrate increasing duo to add the bottom magnetic field. Structural characterization revealed that the grain of the diamond film in the arc main were coarse, affected by the shape of DC arc plasma, while in the arc center and edge were fine. The main orientation of polycrystalline structure of the diamond film was the crystalline plane of (220). The Raman peaks of diamond film in different areas moved to a higher wavelength, indicating the existence of compressive stress inside the diamond film. The coarse columnar grain and a few grain boundaries were in the arc main. Therefore, the average value of the thermal conductivity (k ⊥) of diamond film measured in the arc main was 1728.9 ± 4.9 W/(m·k). Meanwhile, the thermal conductivity of the arc center and edge area was lower than that of the arc main. [Display omitted] • A freestanding diamond thermal conductive film with a diameter of about 7 in. was prepared. • DC arc plasma jet CVD with multi-stage magnetic fields was adopted. • The average value of the thermal conductivity (k ⊥) of diamond film measured in the arc main was 1728.9 ± 4.9 W/(m·k). [ABSTRACT FROM AUTHOR]

In order to realize the practical use of diamond as a semiconductor material, large-area single-crystal diamond wafers with uniform quality are required. Mosaic growth is an effective method to produce inch-grade single-crystal diamonds. However, the quality of the wafer is limited by the junction interface seriously, because cracking occurs easily due to the high internal stress. In this paper, the repetition growth method was adopted to grow mosaic splicing single-crystal diamond without polycrystalline diamond interface. The high-quality single crystal diamond slices were reduplicated by microwave plasma chemical vapor deposition (MPCVD). The substrates were obtained by cutting a piece of CVD diamond along a plane perpendicular to 〈001〉 (with a (100)-oriented surface). The evolution of the growth characteristics around the junction of the substrates at different stages was studied. The results show that the surface of the epitaxial layers gradually evolves from blurry terraces to a regular well-ordered step flow. When the substrates have the same deviation direction and the off-direction angles are within 3°, the junction of the substrates can connect smoothly. Raman mapping shows that there is a mixture of tensile stress and compressive stress near the junction. As the thickness of the epitaxial layer increases from 280 μm to 560 μm, the range of tensile stress near the joint area expands from 85 μm to 150 μm, the maximum tensile stress increases from 0.08 GPa to 0.16 GPa. In addition, the value of FWHM in the X-ray rocking curve is less than 2.80 cm−1 around the junction, which indicates good crystal quality. [Display omitted] • The evolution of growth characteristics around the junction in the mosaic diamond was studied. • The mosaic boundary evolved from blurry terraces to a well-ordered step flow and finally connected. • The lowest value of tensile stress near the joint area was reported as the film thickness increased. • The larger FWHM of Raman peak around the junction is caused by the increased tensile stress. • The "inherit" effect of NV content of the epitaxial layer was observed for the corresponding substrate. [ABSTRACT FROM AUTHOR]

To improve the transmittance of chemical vapor deposition (CVD) diamond, erbium(III) oxide (Er 2 O 3) antireflective films were deposited on CVD diamond substrates by radio frequency (RF) magnetron sputtering. Effects of deposition temperature on structure, chemical composition and properties of the samples were investigated. A strong correlation was observed between the deposition temperature and crystalline structure evolution of the Er 2 O 3 antireflective films. With rising deposition temperature, the deposition rate, grain size and surface roughness of the Er 2 O 3 antireflective films increased. Changes of composition and chemical bonding of the films were analyzed. Results showed that the amount of bonding between Er and O atoms surface as the temperature increased. The films were structured by amorphous, monoclinic and cubic phase, with preferential orientations of C-Er 2 O 3 {222} at deposition temperature increased to 400 °C. A thickness of 10 nm transition layer was observed between the Er 2 O 3 antireflective films and the CVD diamond substrates by transmission electron microscopy (TEM). Moreover, the transition layer feature primarily consisted of Er, O and C. The hardness and modulus of Er 2 O 3 antireflective films were increased for higher deposition temperature, which positively affects the IR transmittance and adhesion strength of the Er 2 O 3 antireflective films on CVD diamond substrates. • The maximum transmittance of Er 2 O 3 /diamond sample was 80% in 7–11 μm range. • Texturization of Er 2 O 3 film interface was studied by HRTEM. • The higher deposition temperature favors crystallization of Er 2 O 3 film. • This study meets the requirements of windows for infrared (IR) imaging systems coating in the LWIR range. [ABSTRACT FROM AUTHOR]

A piece of diamond film (Ø 125 mm) was polished based on prefabricated stress. The diamond film was glued to a metal workpiece at high temperatures. The difference in the thermal expansion coefficients between the diamond film and the workpiece was exploited to prefabricate stress in the middle of the two materials. This prefabricated stress had a compressive effect on the diamond film, offset the stress generated in the grinding and polishing process, and prevented the diamond film from cracking. The feasibility of the prestressing method was verified by a combination of experiments and finite element simulations. The prestressing method was used to bond the diamond film to a 10 mm-thick brass fixture at 20, 50, 70, and 90 °C. It was found that when the temperature of the bonded diamond film reached 90 °C, the increase in the prefabricated stress was −410.71 MPa. The finite element simulation results were found to be consistent with the experimental data. The diamond film was cooled down to room temperature after bonding at high temperatures to simulate the prefabricated stress generation process. The diamond film with the prefabricated stress was again heated to the bonding temperature to simulate the stress change caused by the frictional heat generated during the polishing process. The stress of the bonded sample increased when it was cooled down to room temperature. The stress on the diamond surface became smaller during the polishing process, and the stress almost disappeared with the rise in bonding temperature, verifying the viability of the prestressing method. [Display omitted] • Prestressing method to polish a large-sized diamond film was proposed. • Diamond film was bonded to the metal fixture at high temperature and cooled. • The prefabricate stress was measured and simulated. • A Ø125 mm diamond film was successfully polished using this idea. [ABSTRACT FROM AUTHOR]

The fabrication of GaN-on-diamond structure by the process of diamond growth on GaN technology is becoming more and more attractive for high-power GaN devices. However, due to the high-temperature steps employed during the GaN epitaxial layer transfer process, significant stress accumulates in the GaN-on-diamond structure and induces the formation of cracks or deformations in the GaN layer. To improve the stress characteristics of the GaN layer, in this work, dual-sided diamond film deposition was carried out to accomplish the GaN-on-diamond structure. The surface morphology, interface microstructure and crystal quality of diamond on GaN were analyzed by using scanning electron microscopy, atomic force microscopy, transmission electron microscopy and X-ray diffraction. The results showed that the stress accumulation originating from the GaN epitaxial layer transfer process was effectively alleviated as compared with other reporteds in the literature and that the crystal quality of the GaN was only slightly altered. The stress relaxation was attributed to the low-quality diamond used as the temporary carrier during the GaN transfer process. In addition, a thin SiC transition layer in the interface is also beneficial in alleviating the mismatch between the coefficients of thermal expansion for the GaN and the diamond. [ABSTRACT FROM AUTHOR]

The surface conductivity on the H-terminated diamond is still an interesting topic in the field of diamond electronics. Until now, the carrier mobility in the conductive channel has been limited to below 200cm2/Vs due to the various surface scattering mechanisms. In this paper, a high mobility conductive channel on the H-terminated diamond surface was reported. Firstly, the high quality diamond films were deposited on the commercial CVD diamond substrates. After polishing, the H-termination was obtained by hydrogen plasma treatment. The surface morphology of the H-terminated diamond was observed by atomic force microscope (AFM) and scanning electron microscope (SEM). The crystal quality on the diamond surface was characterized by Raman spectroscopy. The impurities in the crystals were tested by photoluminescence spectroscopy. The surface conductivity of H-terminated diamond was monitored comprehensively by Hall test. It can be found that the sheet resistance decreases much and the carrier mobility increases dramatically after the hydrogen plasma treatment and mechanical cleaning. The maximum mobility value is up to 365cm2/Vs with carrier density of 2.9 × 1012 cm−2, which is the highest value reported. Raman spectra of diamond surface show that a peak appears at 1121.4 cm−2 after the hydrogen plasma treatment, which corresponds to the nanocrystal diamond or carbon clusters of sp3 bonded material. The corresponding mobility enhancement mechanism on the H-terminated diamond surface was proposed. Unlabelled Image • The carrier mobility enhancement on the H-terminated diamond surface was found. • A thin carbon film on the diamond surface was observed with Raman peak at 1121 cm−1. • The H-terminated diamond surface showed high carrier mobility of 365cm2/Vs. • The corresponding mobility enhancement mechanism was proposed. [ABSTRACT FROM AUTHOR]

Lift-off is a promising method to prepare thin, high-finish, and freestanding large-area single crystal and polycrystalline diamonds. However, accurate control of the damage layer characteristic to achieve both stress release and lift-off process is difficult. In this work, high-energy C+ was implanted in single crystal diamond and polycrystalline diamond to create subsurface damage. The defect behavior and structural transformation of the ion implantation and annealing process were investigated. The homoepitaxial growth was subsequently carried out and the epitaxial layer was lifted off from the substrate by selectively etching the damaged layer. The results show that the cap layer and the substrate (below the damage layer) keep the sp3 carbon structure before and after annealing, which is confirmed by the atomic-scale electron energy loss spectroscopy (EELS). The high-resolution transmission electron microscopy (HRTEM) images show that after annealing at 1000 °C for 1 h, the damaged layer was transformed from amorphous carbon to a mixture of graphite and amorphous carbon, providing the damaged layer that could be removed by electrochemical solution. Meanwhile, the distorted diamond area was changed to a sharp interface, which ensures the low roughness of the substrate surface after the lift-off process. After etching for 30 h, a freestanding polycrystalline diamond film with a thickness of 100 μm and a surface roughness of 1.68 nm was obtained. The roughness of the lift-off substrate surface is 1.10 nm, indicating the epitaxial growth can be repeated directly without polishing. [Display omitted] • The defect behavior and structural transformation of the high-energy C+ implanted diamonds were investigated. • The stress state of the diamonds before and after ion implantation and after lift-off process were evaluated. • A 100 μm-thick freestanding polycrystalline diamond film with a surface roughness of 1.68 nm was successful obtained. [ABSTRACT FROM AUTHOR]

[Display omitted] • The La-doped Er 2 O 3 anti-reflection films was prepared by the power of magnetron sputtering. • The compound of La 2 O 3 formed along the grain boundary of the columnar crystal structure of the polycrystalline film. • The highest hardness and yield strength of the La-doped Er 2 O 3 film was two times higher than that of pure Er 2 O 3 film. • The transmittance of the La-doped Er 2 O 3 anti-reflection films only decreased 1% after erosion. The composition and microstructure consisting of anti-reflection films was obtained by the power of magnetron sputtering. X-ray photoelectron spectroscopy (XPS) and High-resolution transmission electron microscopy (HRTEM) provided evidence to support that the doping La element exists as oxide in the grain boundaries of the matrix Er 2 O 3 films. The undoped and La-doped Er 2 O 3 films show a columnar crystal structure of the main cubic (2 2 2) plane. Twinning and a large number of dislocations show up in the undoped Er 2 O 3 films due to the competitive growth of the columnar crystal. In addition, the La-doped Er 2 O 3 films show a lower roughness (RMS) value in comparison with undoped Er 2 O 3 films. The grain size of columnar crystals decreases significantly with increasing La concentration in the La-doped Er 2 O 3 films. The fine grains resulted in the La-doped Er 2 O 3 films developing high mechanical and impact resistance properties, with an increase in hardness from 12.6 ± 2.1 GPa to 26.1 ± 3.4 GPa and the eroding area rate decreasing from 38.9 % to 1.9 %. Moreover, the La-doped Er 2 O 3 anti-reflection films on the chemical vapor deposition (CVD) diamond substrate maintained 74 % transmittance in the long-wavelength infrared range of 8–12 μm after sand eroding. [ABSTRACT FROM AUTHOR]

• 21% increase of maximum transmittance of Er2O3 films deposited on diamond coatings. • Negative electrical bias induces the formation of monoclinic Er2O3 on Si(110). • Monoclinic Er2O3 effectively improve the transmittance of the diamond coating. Er 2 O 3 anti-reflection films were deposited on the surface of the chemical vapor deposited diamond films and Si(100) substrates by radio frequency magnetron sputtering. The microstructure of the Er 2 O 3 thin films and the interfacial layer were investigated by means of scanning electron microscopy, X-ray diffraction, atomic force microscopy and transmission electron microscopy. The refractive index, hardness and transmittance of the films were measured by ellipsometry, nanoindentation measurements, and Fourier transformed infrared spectroscopy. Results revealed that the bias induces the formation of a monoclinic phase and the nucleation of the Er 2 O 3 thin films is mainly observed along the (222) plane. A high-resolution TEM image revealed a 2.5-nm-thick amorphous layer at the interface between the Si substrate and Er 2 O 3 film. Notably, monoclinic Er 2 O 3 films can considerably improve the transmittance of the diamond film in the long-wavelength infrared range of 8–12 μm via the reduction of the refractive index. However, the introduction of the monoclinic phase led to the decrease of the hardness and elastic modulus of the films; hence, controlling a suitable amount of the monoclinic phase may play an extremely important role in the mechanical and optical properties of the Er 2 O 3 films. [ABSTRACT FROM AUTHOR]