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1. Photonic packaging using laser/receiver arrays and flexible optical circuits.

Author

Grimes, Gary J., Markush, J.P.C., Yiu-Man Wong, Anthony, P. J., Holland, Bob, Priest, Eric G., Sherman, C. J., Peck, S. R., Muehlner, Dirk J., Faudskar, C. C., Nyquist, J. S., Helton, J. S., Lepthian, Carol A., Sonnier, G. L., Gates, J. V., Honea, W. K., and Bartolini, J. R.

Subjects
*OPTOELECTRONIC devices, *TECHNOLOGICAL innovations
Abstract

Focuses on the application of optoelectronic modules and multifiber optical connectors to intrasystem interconnection within a large telecommunication transmission terminal. Description of the optoelectronic modules; Density of the optical modules and connectors.

Published
1997
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