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Leprosy has long-term consequences related to impairment and stigma. This includes a major impact on mental health. This study aims to consolidate current evidence regarding the mental health impact of leprosy on affected persons and their family members. In addition, determinants influencing mental health outcomes among leprosy-affected persons and effective interventions are examined. A keyword-based search was conducted in PubMed, Web of Science, Scopus, PsycINFO, Infolep and InfoNTD; additional literature was also considered. Articles presenting primary data involving leprosy-affected persons or their family members experiencing mental conditions were included. Independent extraction of articles was executed using predefined data fields. Articles were sorted according to relevance. In total, 65 studies were included in this systematic review. Multiple psychiatric morbidities have been identified among leprosy-affected persons, including depression, anxiety disorders and suicide (attempts). Additional factors were found that may impact mental health. Moreover, studies found that demographic factors, lifestyle and disease-specific factors and stigma and discrimination impact mental health. Depressive symptoms and low self-esteem were identified among children of leprosy-affected persons. In addition, interventions were identified that could improve the mental wellbeing of leprosy patients. Depressive disorders and anxiety disorders were found to be very common among persons affected by leprosy. Feelings such as fear, shame and low self-esteem are also experienced by those affected, and their children. Further research is necessary to ensure that mental health impact is included when determining the burden of disease for leprosy, and to relieve this burden. [ABSTRACT FROM AUTHOR]

The shear cutting of electrical steel sheets has a significant influence on the magnetic and mechanical material properties. Due to plastic deformation and strain hardening in the area of the punched edge, the electrical steel sheets exhibit a characteristic hardness profile. This study deals with the modelling of the resulting hardness profile by means of finite‐element simulations. Elastic‐plastic material properties are obtained from spherical nanoindentation testing as a function of the local hardness. In particular, representative stress‐strain values are determined by applying Tabor's concept of indentation stress‐strain curves. The choice of the appropriate stress‐ and strain‐constraint factors is discussed with respect to the nanoindentation test setup used. Following this, the representative stress‐strain values are analytically described to determine true stress‐strain curves for the local assignment of different material models depending on the hardness. The implementation of the modelling approach in a finite‐element simulation is presented for a punched electrical steel sheet specimen under monotonic loading. The simulation results are basically in good agreement with experimental data and confirm the expected influence on the mechanical material behaviour due to the shear cutting process. [ABSTRACT FROM AUTHOR]

The combined isotropic‐kinematic hardening model enables the description of the cyclic transient elastic‐plastic material behaviour of steel. However, the determination of the material model parameters and understanding of their influence on the material response can be a challenging task. This study deals with the individual steps of the material model calibration for the simulation of thin electrical steel sheets under cyclic loading. Specific recommendations are made for the determination of kinematic and isotropic hardening material parameters. In particular, the isotropic hardening evolution is described by Voce's exponential law and a simple multilinear approach. Based on the multilinear approach, which allows for different slopes in the evolution of the yield surface size, an alternative calibration of the isotropic hardening component is proposed. As a result, the presence of the yield plateau in the first half cycle can be accurately captured, while convergence issues in the material model definition for numerical simulations can be avoided. The comparison of simulated load cycles with experimental cyclic tests shows a good agreement, which indicates the suitability of the proposed material model calibration for electrical steel. [ABSTRACT FROM AUTHOR]

This paper gives an insight into high cycle fatigue (HCF) behaviour of a Pb-free solder alloy in the region between 10 4 up to 10 9 fatigue cycles using fatigue specimen. By means of a local stress approach, the method can be translated into solder joint fatigue evaluation in an application. The effect of temperatures (35 °C, 80 °C, 125 °C) on the fatigue property of Pb-free solder alloy is considered in this work to understand the possible fracture mechanisms and micro structural changes in a solder alloy at elevated temperature. Experiments are performed for different interaction factors under mean stresses ( R = 0, − 1, − 3), stress concentration (notched, un-notched) and surface roughness. SN (stress-life) diagrams presented in this work will compare the fatigue performance of Sn 3.8 Ag 0.7 Cu solder alloy for different conditions. Furthermore, mathematical fatigue model based on FKM guideline (in German “Fachkuratorium Maschinenbau) is extracted out of the experiments under all these external effects. The models can be exported later for lifetime evaluation purposes on applications. The paper thereby proposes the use of FKM guideline in the field of microelectronics. [ABSTRACT FROM AUTHOR]

The article proposes a generalized high cycle fatigue evaluation methodology for solder joints based on a local stress finite element method (FEM) and compares with experimental results. A method to predict the damage initiation of surface mount technology (SMT) solder joints is accomplished in this article by making use of generic coupon level SAC387 solder specimens. High cycle fatigue (HCF) experiments conducted on generic solder specimens are followed by means of FKM guidelines, which are translated to microelectronic elements for the first time. The FEM predicted lifetime values of solder joints agree with the experimental results performed on SMT components. In addition, the overall results show that the predicted values act as a threshold damage line from which the solder joint failure regimes can be differentiated. The results also show the differences in the predicted damage line and failure line for SMT solder joints. • Generic coupon level solder specimen to predict the damage line of an SMT solder joint. • Simplistic SN method based on the FKM guidelines used first time in microelectronics. • Predicted damage line and failure line are different depending on the component type. [ABSTRACT FROM AUTHOR]