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1. Electrical interconnect design for testing of high-speed IC transceivers.

Author

Rimolo-Donadio, R., Baks, C., Lee, B. G., Song, J. H., Gu, X., Kwark, Y. H., Kuchta, D. M., Rylyakov, A. V., and Schow, C. L.

Abstract

This paper discusses the requirements and challenges associated with the design of electrical interconnects to support the test and evaluation of high-speed transceivers working up to 40 Gb/s. It will be shown that relatively low cost technologies such as FR-4 boards, push-on connectors, and wire bonding can effectively achieve this goal. A specific platform and its application for testing of a 40-Gb/s VCSEL-based optoelectronic link are presented. [ABSTRACT FROM PUBLISHER]

Published
2012
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6. Communication technologies for exascale systems.

Author

Kash, J. A., Pepeljugoski, P., Doany, F. E., Schow, C. L., Kuchta, D. M., Schares, L., Budd, R., Libsch, F., Dangel, R., Horst, F., Offrein, B. J., Vlasov, Y., Green, W., Xia, F., Baks, C. W., Kwark, Y. H., Kam, D. G., and Ritter, M. B.

Published
2009
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16. End-to-End Multicore Multimode Fiber Optic Link Operating up to 120 Gb/s.

Author

Lee, B. G., Kuchta, D. M., Doany, F. E., Schow, C. L., Pepeljugoski, P., Baks, C., Taunay, T. F., Benyuan Zhu, Yan, M. F., Oulundsen, G., Vaidya, D. S., Wenlin Luo, and Neinyi Li

Abstract

A full multicore fiber optic link is demonstrated, transmitting greater than 100 Gb/s through a single strand of multimode fiber for the first time. The fiber, which consists of seven graded-index multimode cores, is used to transmit up to 120 Gb/s over 100 m using a custom multicore-fiber interfacing transmitter and receiver. 2-D arrays of vertical-cavity surface-emitting lasers (VCSELs) and vertically illuminated photodiodes (PDs) are fabricated with a geometry corresponding to the outer six cores of the seven-core fiber, which is arranged in a hexagonal pattern. Both flip-chip and wire-bonding technologies are used to package the VCSEL and PD chips with multichannel transmitter and receiver integrated circuits. Amplitude and timing margins of the end-to-end signals are analyzed through bit-error-rate (BER) measurements. The effects of electrical and optical crosstalk are shown to result in negligible degradation to the BER performance. [ABSTRACT FROM PUBLISHER]

Published
2012
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17. Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers.

Author

Doany, F. E., Schow, C. L., Lee, B. G., Budd, R. A., Baks, C. W., Tsang, C. K., Knickerbocker, J. U., Dangel, R., Chan, B., How Lin, Carver, C., Jianzhuang Huang, Berry, J., Bajkowski, D., Libsch, F., and Kash, J. A.

Abstract

We report here on the design, fabrication, and characterization of highly integrated parallel optical transceivers designed for Tb/s-class module-to-module data transfer through polymer waveguides integrated into optical printed circuit boards (o-PCBs). The parallel optical transceiver is based on a through-silicon-via silicon carrier as the platform for integration of 24-channel vertical cavity surface-emitting laser and photodiode arrays with CMOS ICs. The Si carrier also includes optical vias (holes) for optical access to conventional surface-emitting 850 nm optoelectronic devices. The 48-channel 3-D transceiver optochips are flip-chip soldered to organic carriers to form transceiver optomodules. Fully functional optomodules with 24 transmitter + 24 receiver channels were assembled and characterized with transmitters operating up to 20 Gb/s/ch and receivers up to 15 Gb/s/ch. At 15 Gb/s, the 48-channel optomodules provide a bidirectional aggregate bandwidth of 360 Gb/s. In addition, o-PCBs have been developed using a 48-channel flex waveguide assembly attached to FR4 electronic boards. Incorporation of waveguide turning mirrors and lens arrays facilitates optical coupling to/from the o-PCB. Assembly of optomodules to the o-PCB using a ball grid array process provides both electrical and optical interconnections. An initial demonstration of the full module-to-module optical link achieved >; 20 bidirectional links at 10 Gb/s. At 15 Gb/s, operation at a bit error ratio of <; 10- 12 was demonstrated for 15 channels in each direction, realizing a record o-PCB link with a 225 Gb/s bidirectional aggregate data rate. [ABSTRACT FROM PUBLISHER]

Published
2012
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18. Transmitter Predistortion for Simultaneous Improvements in Bit Rate, Sensitivity, Jitter, and Power Efficiency in 20 Gb/s CMOS-Driven VCSEL Links.

Author

Rylyakov, A. V., Schow, C. L., Lee, B. G., Doany, F. E., Baks, C. W., and Kash, J. A.

Abstract

The effect of applying feed-forward equalization (FFE) on the transmitter side is studied for three different full optical links. In contrast to all previous works, the FFE settings are optimized for a complete link, rather than just the vertical-cavity surface-emitting laser output. The approach results in dramatic improvements in total link performance: >; 6 dB in sensitivity, 3X in timing margin, and 2X in power efficiency at 15 Gb/s, and a record 5.7 pJ/bit at 20 Gb/s. [ABSTRACT FROM PUBLISHER]

Published
2012
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21. 120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station.

Author

Kuchta, D.M., Kwark, Y.H., Schuster, C., Baks, C., Haymes, C., Schaub, J., Pepeljugoski, P., Shan, L., John, R., Kucharski, D., Rogers, D., Ritter, M., Jewell, J., Graham, L.A., Schrodinger, K., Schild, A., and Rein, H.-M.

Abstract

A 120-Gb/s optical link (12 channels at 10 Gb/s/ch for both a transmitter and a receiver) has been demonstrated. The link operated at a bit-error rate of less than 10-12 with all channels operating and with a total fiber length of 316 m, which comprises 300 m of next-generation (OM-3) multimode fiber (MMF) plus 16 m of standard-grade MMF. This is the first time that a parallel link with this bandwidth at this per-channel rate has ever been demonstrated. For the transmitter, an SiGe laser driver was combined with a GaAs vertical-cavity surface-emitting laser (VCSEL) array. For the receiver, the signal from a GaAs photodiode array was amplified by a 12-channel SiGe receiver integrated circuit. Key to the demonstration were several custom testing tools, most notably a 12-channel pattern generator. The package is very similar to the commercial parallel modules that are available today, but the per-channel bit rate is three times higher than that for the commercial modules. The new modules demonstrate the possibility of extending the parallel-optical module technology that is available today into a distance-bandwidth product regime that is unattainable for copper cables. [ABSTRACT FROM PUBLISHER]

Published
2004
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25. Terabit/sec VCSEL-based parallel optical module based on holey CMOS transceiver IC.

Author

Doany, F. E., Lee, B. G., Rylyakov, A. V., Kuchta, D. M., Baks, C., Jahnes, C., Libsch, F., and Schow, C. L.

Abstract

We report a 24 TX + 24 RX transceiver underpinned by a “holey” CMOS IC. All channels operate at 20 Gb/s (BER <10−12, 7.3 pJ/bit) achieving record aggregate bidirectional bandwidth for parallel transceivers: 0.48 Tb/s. [ABSTRACT FROM PUBLISHER]

Published
2012

32. 25-Gb/s 6.5-pJ/bit 90-nm CMOS-Driven Multimode Optical Link.

Author

Schow, C. L., Rylyakov, A. V., Baks, C., Doany, F. E., and Kash, J. A.

Abstract

We report an 850-nm, vertical-cavity surface-emitting laser (VCSEL)-based optical link that achieves new benchmarks in speed and power efficiency. The laser diode driver and receiver ICs are fabricated in standard 90-nm bulk CMOS, and the gallium arsenide optoelectronic devices are commercial components. An operation at a bit-error rate less than 10-12 at 25 Gb/s is achieved, representing the highest speed reported to date for a CMOS-based full optical link. At 22 Gb/s, the link power efficiency is 3.8 pJ/bit and improves further at lower data rates, attaining a minimum of 2.6 pJ/bit at 15 Gb/s. The efficiency numbers reported here, which include a complete accounting of the power dissipation of all the components, are the best reported for any optical interconnect in any technology. This work demonstrates the scalability of VCSEL-based links in both efficiency and speed to meet the demanding requirements of next-generation exa-scale computing and large data center systems. [ABSTRACT FROM PUBLISHER]

Published
2012
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33. A 55Gb/s directly modulated 850nm VCSEL-based optical link.

Author

Kuchta, D. M., Rylyakov, A. V., Schow, C. L., Proesel, J. E., Baks, C., Kocot, C., Graham, L., Johnson, R., Landry, G., Shaw, E., MacInnes, A., and Tatum, J.

Abstract

We report a directly modulated 850nm VCSEL-based Optical link operating at 55Gb/s. This is the highest modulation rate for VCSEL-based link of any wavelength. [ABSTRACT FROM PUBLISHER]

Published
2012
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34. A 25-Gb/s 49-mW CMOS-driven equalized optical link.

Author

Lee, B. G., Proesel, J., Rylyakov, A. V., Baks, C., Li, N. Y., Xie, C., Jackson, K. P., and Schow, C. L.

Abstract

A low-power CMOS-driven VCSEL-based link using a 2-tap feed-forward equalizer in the transmitter is reported at 850-nm wavelengths. Power efficiencies of 1.5, 2.0, and 3.8 pJ/b are achieved at 22.5, 25, and 28.5 Gb/s, respectively. [ABSTRACT FROM PUBLISHER]

Published
2012
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41. Terabus: a chip-to-chip parallel optical interconnect.

Author

Kash, J.A., Doany, F., Kuchta, D., Pepeljugoski, P., Schares, L., Schaub, J., Schow, C., Trewhella, J., Baks, C., Kwark, Y., Schuster, C., Shan, L., Patel, C., Tsang, C., Rosner, J., Libsch, F., Budd, R., Chiniwalla, P., Guckenberger, D., and Kucharski, D.

Published
2005
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