1. Effect of interlayer materials on microstructure, hardness and corrosion resistance of an electromagnetic welded titanium–stainless steel interface.
- Author
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Chebolu, Rohinikumar, Kakarla, Mahalakshmi, Nallu, Ramanaiah, Sharma, Surender Kumar, Barmavatu, Praveen, and Sharma, Archana
- Subjects
CORROSION resistance ,INTERMETALLIC compounds ,MICROSTRUCTURE ,HARDNESS ,SCANNING electron microscopy ,STAINLESS steel ,ALUMINUM foil - Abstract
Electromagnetic welding, also referred to as magnetic pulse welding, is a solid-state welding method utilized for joining two distinct materials through high velocity impact. The direct fusion of stainless steel with titanium poses various difficulties owing to the absence of metallurgical compatibility and the occurrence of brittle intermetallic compounds such as FeTi and CrTi. To tackle these challenges, a sustainable, low heat input method like impact welding was applied to address the metallurgical compatibility of the two metals. In this study, a new technique involving aluminum foil, silver foil, and nitinol powder as intermediary materials was investigated to establish a fresh bimetallic structure between Ti-SS304L. Thorough analysis of microstructures, interface formations, and reactions was conducted using scanning electron microscopy and X-ray diffraction. The outcomes showcased successful prevention of intermetallic phase formation through the incorporation of these intermediary materials. Microhardness measurements indicated the absence of brittle FeTi and CrTi phases at the welding interface. Additionally, the weld interface was observed to be situated amid two intermetallic layers at the Ti-SS304L interface, ensuring resistance against corrosion. This inventive method not only averted the creation of harmful intermetallic compounds but also bolstered the overall strength and corrosion resilience of the joint between titanium and stainless steel. The micro hardness obtained at Ti-SS304L interface is 305 Hv and also improved 20% at interface of interlayer materials. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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