1. Micro via filling plating technology for IC substrate applications.
- Author
-
Cheng-Ching Yeh, Kuo-Hsing Lan, Wei-Ping Dow, Jui-Hsia Hsu, Cliff Lee, Chih-Hao Hsu, Ken Lee, Jordan Chen, and Philip Lu
- Subjects
ELECTRONICS ,ELECTRONIC circuits ,TECHNOLOGY ,PLATING ,METAL coating - Abstract
The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit board industry to incorporate high density interconnection technology (such as build-up and semi-additive processes). Micro stacked via is one technology utilized to produce high-density structures. Dielectric resin, conductive paste or via plating are usually applied for the filling process. As compared with other filling methods, via filling plating technology has advantages in offering a shorter process and higher reliability. This paper discusses the influence of different equipment design, operating conditions and additives on via filling plating technology. [ABSTRACT FROM AUTHOR]
- Published
- 2004