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This paper presents a fabrication process for integrated inductors on a flexible substrate using a simple and cost effective method. Kapton was the choice for the substrate due to its attractive characteristics such as thermal stability and electrical insulation. Metal layers were formed by the deposition of a thin Ni film onto the substrate as a seed for Au electroplating deposition and to improve the adhesion between the metal and the substrate. Au lines were patterned by lift-off and served as a mask for Ni wet etching. SiO2 was selected as the dielectric, also patterned by lift-off and preceded by a Cr e-beam deposition step to enhance adhesion. Inductor structures were formed by a conventional photolithography process. There was no need for substrate modification to improve metal adhesion with the use of an Ni intermediate layer. Using this process, it was possible to fabricate integrated inductors appropriate for radio frequency and microwave circuits on a flexible substrate with values compatible with those from the simulation and the literature. [ABSTRACT FROM AUTHOR]

Localized induction of DNA damage is a valuable tool for studying cellular DNA damage responses. In recent decades, methods have been developed to generate DNA damage using radiation of various types, including photons and charged particles. Here we describe a simple ultrasoft X-ray multi-microbeam system for high dose-rate, localized induction of DNA strand breaks in cells at spatially and geometrically adjustable sites. Our system can be combined with fixed- and live-cell microscopy to study responses of cells to DNA damage. [ABSTRACT FROM AUTHOR]

In this communication, we describe for the first time the integration of concentric electrodes (wrapping around the microchannel) in microchips. The use of such electrodes has been shown to be effective towards improvement of the sensitivity and detectability in pressure-driven flow platforms incorporating C4D. [ABSTRACT FROM AUTHOR]

A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives. [ABSTRACT FROM AUTHOR]