Search

Monolithic Active Pixel Sensors (MAPS) represent one of the most promising technologies for the next generation of radiation detectors. The ARCADIA project aims at the development of Fully Depleted (FD) MAPS employing a production process compatible with a 110 nm commercial CMOS technology. The first engineering run of the project included matrices of active pixels with embedded analog and digital frontend electronics and passive test structures such as passive pixel arrays, MOS capacitors and backside diodes. Although the produced samples were already characterized from the electrical point of view, a thorough study of the charge collection dynamics of the passive pixel arrays was still missing. In this paper we show the results of the dynamic characterization of a group of passive pixel arrays with different pixel pitches (50, 25 and 10 μm) and different pixel layouts. The tested samples have been illuminated from the backside with an infrared and a red laser with wavelengths equal to 1,060 nm and 660 nm, respectively. The pixel arrays have been mounted on a custom readout PCB connected to an external amplifier with 1 GHz bandwidth and the signals have been acquired through a fast digital oscilloscope. We employed both focused and unfocused laser spots to evaluate the change in the measured signal as a function of the laser spot position and the average response of the pixel arrays. An excellent agreement has been demonstrated by comparing the measured signals with the results of transient TCAD simulations and a time for 50% charge collection of 7.8, 4.2 and 2.6 ns has been predicted and experimentally validated in pixels with 50, 25 and 10 μm pitch, respectively.

The 3D trench silicon pixel sensors developed by the TimeSPOT collaboration have demonstrated exceptional performance, even after exposure to extreme radiation fluences up to 1⋅1017 1 MeV neq/cm2. This study assesses the radiation tolerance of these sensors using minimum ionizing particles during a beam test campaign. The results indicate that while radiation damage reduces charge collection efficiency and overall detection efficiency, these losses can be mitigated to levels comparable to non-irradiated sensors by increasing the reverse bias voltage. Charge multiplication was observed and characterised for the first time in 3D trench sensors, revealing a distinct operating regime post-irradiation achievable at bias voltages close to 300 V. Additionally, the timing performance of irradiated sensors remains comparable to their non-irradiated counterparts, underscoring their resilience to radiation damage. Currently, 3D trench silicon detectors are among the fastest and most radiation-hard pixel sensors available for vertex detectors in high-energy physics colliders. These findings highlight the potential of these sensors for new 4D tracking systems of future experiments at the Future Circular Hadron Collider (FCC-hh), advancing the capabilities of radiation-hard sensor technology.

3D trench silicon pixel sensors, recently developed by the TimeSPOT collaboration, have shown excellent performance in terms of spatial resolution, timing precision and detection efficiency. The combination of these three features make them one of the best candidate for inner tracking detectors operating in high luminosity hadron colliders experiments. This article presents systematic characterisations of these devices made with minimum ionising particles on irradiated sensors with neutrons up to 2.5 ⋅ 1016 1 MeV neq cm−2. The results show that 3D trench pixels have extremely high resistance to radiation. The measured time resolution and the detection efficiency of irradiated sensors match those of non-irradiated ones if a slightly higher bias voltage, few tens of Volts, is applied to the pixels. As of today, 3D trench pixels are the only sensors capable of achieving 10 ps time resolution after being irradiated at extremely high fluences, extending by far the capabilities of future tracking systems of HEP experiments operating under extreme conditions.

For the next generation of vertex detectors, the accurate measurement of the charged particle timing at the pixel level is considered to be the ultimate solution in experiments operating at very high instantaneous luminosities. This work shows that the 55 μm × 55 µm wide 150 µm thick 3D trench-type pixels, developed by the TimeSPOT Collaboration, achieve a time resolution close to 10 ps with minimum ionizing particles while maintaining a detection efficiency close to 100% when operated at a tilt angle larger than 10° from normal incidence. This record performance is obtained with software-based constant-fraction algorithms applied to signal waveforms. However, time resolutions as good as 25 ps can be achieved using a simple leading-edge discriminating technique, without any amplitude correction. Similar timing performances can also be achieved when the charged particles cross two nearby pixels if both signal amplitudes are measured. 3D trench-type pixels, as of today, are the fastest charged-particles pixel detectors available and represent a very promising solution for the future upgrade of tracking systems of many HEP experiments operating in extreme conditions.

Fully depleted monolithic active pixel sensors (FD-MAPSs) represent a state-of-the-art detector technology and profit from a low material budget and cost for high-energy physics experiments and other fields of research like medical imaging and astro-particle physics. Compared to the MAPS currently in use, fully depleted pixel sensors have the advantage of charge collection by drift, which enables a fast and uniform response overall to the pixel matrix. The functionality of these devices has been shown in previous proof-of-concept productions. In this article, we describe the optimization of the test pixel designs that will be implemented in the first engineering run of the demonstrator chip of the ARCADIA project. These optimization procedures include radiation damage models that have been employed in Technology Computer Aided Design simulations to predict the sensors’ behavior in different working environments.