11 results on '"Jalar, Azman"'
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2. Effect of alloy particle size and stencil aperture shape on solder printing quality
3. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
4. Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
5. Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds
6. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition
7. Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly
8. Deformation behavior relationship between tensile and nanoindentation tests of SAC305 lead-free solder wire
9. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
10. Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates
11. Study of the side gate junctionless transistor in accumulation region
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