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3 results on '"Dabral S"'

1. Metal/polymer interface adhesion by partially ionized beam deposition

Author

Wu, P.K., Dabral, S., Yang, G.-R., Gittleman, B., Li, C., McDonald, J.F., and Lu, T.-M.

Subjects
Semiconductors -- Bonding, Metal bonding -- Research, Ion bombardment -- Research, Polymers -- Electric properties, Physics
Abstract

A peel strength of larger than 70 g/mm adhesion can be attained between Cu and Parylene-N surfaces by applying the partially ionized beam deposition method while the usual deposition methods such as thermal evaporation, e-beam evaporation and sputtering provide no measurable adhesion. Secondary-ion-mass spectroscopy showed a Cu-Parylene-N intermixed layer situated at the Cu/Parylene-N interface.

Published
1996

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