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Expensive testing equipment which are used for probing or electronically testing individual chips (IC) on fabricated wafers sometimes cause the bottleneck for the whole IC manufacturing process. To find a solution, a study was conducted to examine the problem of simultaneous quality and quantity control in semiconductor manufacturing. This study focuses on the problem of selecting the optimal start rate of lots of wafers into the fabrication equipment and the optimal chip screening policy in front of the probing facility to optimize the predicted profit. These decisions are influenced by capacity limitations at both the wafer fabrication and probing facilities. Analysis indicates that screening at the chip level can be very lucrative in a semiconductor manufacturing limited by its probe capacity.