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We report flexible thin-film lead zirconate titanate (PZT)-based ultrasonic transducers on polyimide substrates. The transducers are bar resonators designed to operate in the width extension mode. The active elements are 1 µm thick PZT films that were crystallized on Si substrates at 700 °C and transferred to 5 µm thick solution-cast polyimide via dissolution of an underlying release layer. Underwater pitch-catch testing between two neighboring 100 µm × 1000 µm elements showed a 0.2 mV signal at a 1.5 cm distance for a driving voltage of 5 V peak at 9.5 MHz. With the same excitation, a 33 kPa sound pressure output at a 6 mm distance and a 32% bandwidth at -6 dB were measured by hydrophone.

Piezoelectric micromachined ultrasound transducers (PMUT) incorporating lead zirconate titanate PbZr 0.52 Ti 0.48 O 3 (PZT) thin films were investigated for miniaturized high-frequency ultrasound systems. A recently developed process to remove a PMUT from an underlying silicon (Si) substrate has enabled curved arrays to be readily formed. This research aimed to improve the design of flexible PMUT arrays using PZFlex, a finite element method software package. A 10 MHz PMUT 2D array working in 3-1 mode was designed. A circular unit-cell was structured from the top, with concentric layers of platinum (Pt)/PZT/Pt/titanium (Ti) on a polyimide (PI) substrate. Pulse-echo and spectral response analyses predicted a center frequency of 10 MHz and bandwidth of 87% under water load and air backing. A 2D array, consisting of the 256 (16 × 16) unit-cells, was created and characterized in terms of pulse-echo and spectral responses, surface displacement profiles, crosstalk, and beam profiles. The 2D array showed: decreased bandwidth due to protracted oscillation decay and guided wave effects; mechanical focal length at 2.9 mm; 3.7 mm depth of field for -6 dB; and -55.6 dB crosstalk. Finite element-based virtual prototyping identified figures of merit-center frequency, bandwidth, depth of field, and crosstalk-that could be optimized to design robust, flexible PMUT arrays.

A novel design for a chip-scale miniature oven-controlled crystal oscillator (OCXO) is presented. In this design, all the main components of an OCXO--consisting of an oscillator, a temperature sensor, a heater, and temperature-control circuitry--are integrated on a single CMOS chip. The OCXO package size can be reduced significantly with this design, because the resonator does not require a separate package and most of the circuitry is integrated on a single CMOS chip. Other characteristics such as power consumption and warm-up time are also improved. Two different types of quartz resonators, an AT-cut tab mesa-type quartz crystal and a frame enclosed resonator, allow miniaturization of the OCXO structure. Neither of these quartz resonator types requires a separate package inside the oven structure; therefore, they can each be directly integrated with the custom-designed CMOS chip. The miniature OCXO achieves a frequency stability of +/- 0.35 ppm with an AT-cut tab mesa-type quartz crystal in the temperature range of 0 °C to 60 °C. The maximum power consumption of this miniature OCXO is 1.2 W at start-up and 303 mW at steady state. The warm-up time to reach the steady state is 190 s. These results using the proposed design are better than or the same as high-frequency commercial OCXOs.

High-frequency ultrasound array transducers using piezoelectric thin films on larger structures are being developed for high-resolution imaging systems. The increase in resolution is achieved by a simultaneous increase in operating frequency (30 MHz to about 1 GHz) and close coupling of the electronic circuitry. Two different processing methods were explored to fabricate array transducers. In one implementation, a xylophone bar transducer was prototyped, using thin film PbZr(0.52)Ti(0.48)O(3) (PZT) as the active piezoelectric layer. In the other, the piezoelectric transducer was prepared by mist deposition of PZT films over electroplated Ni posts. Because the PZT films are excited through the film thickness, the drive voltages of these transducers are low, and close coupling of the electronic circuitry is possible. A complementary metal-oxidesemiconductor (CMOS) transceiver chip for a 16-element array was fabricated in 0.35-microm process technology. The ultrasound front-end chip contains beam-forming electronics, receiver circuitry, and analog-to-digital converters with 3-Kbyte on-chip buffer memory.