Search

With the continuous reduction of chip size, fluxless soldering has brought attention to high-density, three-dimensional packaging. Although fluxless soldering technology with formic acid (FA) atmosphere has been presented, few studies have examined the effect of the Pt catalytic, preheating time, and soldering pad on FA soldering for the Sn-58Bi solder. The results have shown that the Pt catalytic can promote oxidation-reduction and the formation of a large pore in the Sn-58Bi/Cu solder joint, which causes a decrease in shear strength. ENIG (electroless nickel immersion gold) improves soldering strength. The shear strength of Sn-58Bi/ENIG increases under the Pt catalytic FA atmosphere process due to the isolation of the Au layer on ENIG. The Au layer protects metal from corrosion and provides a good contact surface for the Sn-58Bi solder. The shear strength of the Sn-58Bi/ENIG joints under a Pt catalytic atmosphere improved by 44.7% compared to using a Cu pad. These findings reveal the improvement of the shear strength of solder joints bonded at low temperatures under the FA atmosphere.

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu 6 Sn 5 forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu 3 Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.

Polar molecules with appreciable permanent dipole moments (PDMs) are widely used as the electron transport layer (ETL) in organic light-emitting devices (OLEDs). When the PDMs spontaneously align, a macroscopic polarization field can be observed, a phenomenon known as spontaneous orientation polarization (SOP). The presence of SOP in the ETL induces considerable surface potential and charge accumulation that is capable of quenching excitons and reducing device efficiency. While prior work has shown that the degree of SOP is sensitive to film processing conditions, this work considers SOP formation by quantitatively treating the vapor-deposited film as a supercooled glass, in analogy to prior work on birefringence in organic thin films. Importantly, the impact of varying thin-film deposition rate and relative temperature is unified into a single framework, providing a useful tool to predict the SOP formation efficiency for a polar material, as well as in blends of polar materials. Finally, in situ photoluminescence characterization and efficiency measurements reveal that SOP-induced exciton-polaron quenching can be reduced through an appropriate choice of processing conditions, leading to enhanced OLED efficiency.

Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.

Light-emitting diodes (LEDs) with directional and polarized light emission have many photonic applications, and beam shaping of these devices is fundamentally challenging because they are Lambertian light sources. In this work, using organic and perovskite LEDs (PeLEDs) for demonstrations, by selectively diffracting the transverse electric (TE) waveguide mode while suppressing other optical modes in a nanostructured LED, the authors first demonstrate highly directional light emission from a full-area organic LED with a small divergence angle less than 3° and a TE to transverse magnetic (TM) polarization extinction ratio of 13. The highly selective diffraction of only the TE waveguide mode is possible due to the planarization of the device stack by thermal evaporation and solution processing. Using this strategy, directional and polarized emission from a perovskite LED having a current efficiency 2.6 times compared to the reference planar device is further demonstrated. This large enhancement in efficiency in the PeLED is attributed to a larger contribution from the TE waveguide mode resulting from the high refractive index in perovskite materials., (© 2021 Wiley-VCH GmbH.)

Perovskite light-emitting diodes have been gaining attention in recent years due to their high efficiencies. Despite of the recent progress made in device efficiency, the operation mechanisms of these devices are still not well understood, especially the effects of ion migration. In this work, the role of ion migration is investigated by measuring the transient electroluminescence and current responses, with both the current and efficiency showing a slow response in a time scale of tens of milliseconds. The results of the charge injection dynamics show that the slow response of the current is attributed to the migration and accumulation of halide ions at the anode interface, facilitating hole injection and leading to a strong charge imbalance. Further, the results of the charge recombination dynamics show that the slow response of the efficiency is attributed to enhanced charge injection facilitated by ion migration, which leads to an increased carrier density favoring bimolecular radiative recombination. Through a combined analysis of both charge injection and recombination dynamics, we finally present a comprehensive picture of the role of ion migration in device operation.

Quasi-2D Ruddlesden-Popper halide perovskites with a large exciton binding energy, self-assembled quantum wells, and high quantum yield draw attention for optoelectronic device applications. Thin films of these quasi-2D perovskites consist of a mixture of domains having different dimensionality, allowing energy funneling from lower-dimensional nanosheets (high-bandgap domains) to 3D nanocrystals (low-bandgap domains). High-quality quasi-2D perovskite (PEA) 2 (FA) 3 Pb 4 Br 13 films are fabricated by solution engineering. Grazing-incidence wide-angle X-ray scattering measurements are conducted to study the crystal orientation, and transient absorption spectroscopy measurements are conducted to study the charge-carrier dynamics. These data show that highly oriented 2D crystal films have a faster energy transfer from the high-bandgap domains to the low-bandgap domains (<0.5 ps) compared to the randomly oriented films. High-performance light-emitting diodes can be realized with these highly oriented 2D films. Finally, amplified spontaneous emission with a low threshold 4.16 µJ cm -2 is achieved and distributed feedback lasers are also demonstrated. These results show that it is important to control the morphology of the quasi-2D films to achieve efficient energy transfer, which is a critical requirement for light-emitting devices., (© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.)

A comprehensive study of the interfacial reactions between Zn-added Sn58Bi solder alloys and electroless Ni/immersion Au (ENIG) substrates during reflow and solid-state thermal aging was conducted. The shear strengths of these samples were tested before and after aging. Zn first reacted with Au forming AuZn₃ intermetallic compounds (IMCs) that detached in small pieces from the substrate and immediately moved into the solder bulk. A very thin Au-Zn-Ni-Sn IMC layer was observed attached to the substrate. This layer, with a thickness of 0.25 μ m, significantly suppressed IMC layer growth during thermal aging, resulting in a thermally stabled joint. By contrast, the thickness of the (Au, Ni)(Sn, Bi)₄ IMC layer on the eutectic Sn58Bi/ENIG interface doubled during aging and, therefore, its shear strength decreased.

High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu 0.5 HEA substrate was investigated. (Cu 0.76 , Ni 0.24 ) 6 Sn 5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu 0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu 0.5 substrate.

Background: Cardiovascular disease (CVD) has become the main cause of morbidity and mortality world-wide., Objective: In order to obtain the potential function of cardiovascular system information further, the parameters of the coupling relationship between Electrocardiogram (ECG) signal and Pulse Wave (PW) signal are proposed., Methods: In this paper, we detected the peaks of ECG and PW signal synchronously from the Fantasia database using Empirical Mode Decomposition (EMD) algorithm, and analyzed the interval between different age groups in the same domain, then calculating the Euclidean distance to characterize the coupling relationship., Results: Via the experimental results of 20 subjects, the parameters of the old group were always larger than the young group. Thus the synchronization and consistency for PW following the ECG are weaker than the young group, which is in keeping with the clinical rule., Conclusions: The conclusion is that there is a certain representation for the cardiovascular system with the coupling relationship parameter proposed.