Search

Efficient thermal insulation materials considerably lower power consumption for heating and cooling of buildings, which in turn minimises CO2 emissions and improves indoor comfort conditions. However, the selection of suitable insulation materials is governed by several factors, such as the environmental impact, health impact, cost and durability. Additionally, the disposal of used insulation materials is a major factor that affects the selection of materials because some materials could be very toxic for humans and the environment, such as asbestos-containing materials. Therefore, there is a continuous research effort, in both industry and academia, to develop sustainable and affordable insulation materials. In this context, this work aims at utilising the packing industry wastes (cardboard) to develop an eco-friendly insulation layer, which is a biodegradable material that can be disposed of safely after use. Experimentally, wasted cardboard was collected, cleaned, and soaked in water for 24 h. Then, the wet cardboard was minced and converted into past papers, then cast in square moulds and left in a ventilated oven at 75 °C to dry before de-moulding them. The produced layers were subjected to a wide range of tests, including thermal conductivity, acoustic insulation, infrared imaging and bending resistance. The obtained results showed the developed material has a good thermal and acoustic insulation performance. Thermally, the developed material had the lowest thermal conductivity (λ) (0.039 W/m.K) compared to the studied traditional materials. Additionally, it successfully decreased the noise level from 80 to about 58 dB, which was better than the efficiency of the commercial polyisocyanurate layer. However, the bending strength of the developed material was a major drawback because the material did not resist more than 0.6 MPa compared to 2.0 MPa for the commercial polyisocyanurate and 70.0 MPa for the wood boards. Therefore, it is recommended to inves, Validerad;2023;Nivå 2;2023-11-21 (joosat);CC BY-NC-ND 4.0 License

Efficient thermal insulation materials considerably lower power consumption for heating and cooling of buildings, which in turn minimises CO2 emissions and improves indoor comfort conditions. However, the selection of suitable insulation materials is governed by several factors, such as the environmental impact, health impact, cost and durability. Additionally, the disposal of used insulation materials is a major factor that affects the selection of materials because some materials could be very toxic for humans and the environment, such as asbestos-containing materials. Therefore, there is a continuous research effort, in both industry and academia, to develop sustainable and affordable insulation materials. In this context, this work aims at utilising the packing industry wastes (cardboard) to develop an eco-friendly insulation layer, which is a biodegradable material that can be disposed of safely after use. Experimentally, wasted cardboard was collected, cleaned, and soaked in water for 24 h. Then, the wet cardboard was minced and converted into past papers, then cast in square moulds and left in a ventilated oven at 75 °C to dry before de-moulding them. The produced layers were subjected to a wide range of tests, including thermal conductivity, acoustic insulation, infrared imaging and bending resistance. The obtained results showed the developed material has a good thermal and acoustic insulation performance. Thermally, the developed material had the lowest thermal conductivity (λ) (0.039 W/m.K) compared to the studied traditional materials. Additionally, it successfully decreased the noise level from 80 to about 58 dB, which was better than the efficiency of the commercial polyisocyanurate layer. However, the bending strength of the developed material was a major drawback because the material did not resist more than 0.6 MPa compared to 2.0 MPa for the commercial polyisocyanurate and 70.0 MPa for the wood boards. Therefore, it is recommended to inves, Validerad;2023;Nivå 2;2023-11-21 (joosat);CC BY-NC-ND 4.0 License

Through silicon via (TSV) is an enabling technology for 3D interconnection. The insulation layer at the bottom of the via usually needs to be removed in order to expose the pad so that the electrical interconnection from the front side to the back side can be realized. This removal may be implemented by plasma etching, laser drilling, or photo-lithography. Compared with the other two methods, photo-lithography is considered having the merits of high efficiency, high reliability and low cost. In this study, we developed a photosensitive polymer insulation material that can be deposited with the spin-coating process. The photosensitive material at the bottom of the TSV was developed with potassium hydroxide (KOH) solution after exposure to thr 365 nm UV light. At last, the residual photosensitive polymer was cured via a preset heating procedure. The resulting polymer insulation layer exhibited excellent thermal stability, good chemical resistance, good adhesion and good thickness uniformity. Such a material may be considered a promising candidate for the insulation layer for the applications of CMOS image sensor (CIS) and fingerprint identification sensor with TSVs having a low aspect ratio.

Through silicon via (TSV) is an enabling technology for 3D interconnection. The insulation layer at the bottom of the via usually needs to be removed in order to expose the pad so that the electrical interconnection from the front side to the back side can be realized. This removal may be implemented by plasma etching, laser drilling, or photo-lithography. Compared with the other two methods, photo-lithography is considered having the merits of high efficiency, high reliability and low cost. In this study, we developed a photosensitive polymer insulation material that can be deposited with the spin-coating process. The photosensitive material at the bottom of the TSV was developed with potassium hydroxide (KOH) solution after exposure to thr 365 nm UV light. At last, the residual photosensitive polymer was cured via a preset heating procedure. The resulting polymer insulation layer exhibited excellent thermal stability, good chemical resistance, good adhesion and good thickness uniformity. Such a material may be considered a promising candidate for the insulation layer for the applications of CMOS image sensor (CIS) and fingerprint identification sensor with TSVs having a low aspect ratio.

Through silicon via (TSV) is an enabling technology for 3D interconnection. The insulation layer at the bottom of the via usually needs to be removed in order to expose the pad so that the electrical interconnection from the front side to the back side can be realized. This removal may be implemented by plasma etching, laser drilling, or photo-lithography. Compared with the other two methods, photo-lithography is considered having the merits of high efficiency, high reliability and low cost. In this study, we developed a photosensitive polymer insulation material that can be deposited with the spin-coating process. The photosensitive material at the bottom of the TSV was developed with potassium hydroxide (KOH) solution after exposure to thr 365 nm UV light. At last, the residual photosensitive polymer was cured via a preset heating procedure. The resulting polymer insulation layer exhibited excellent thermal stability, good chemical resistance, good adhesion and good thickness uniformity. Such a material may be considered a promising candidate for the insulation layer for the applications of CMOS image sensor (CIS) and fingerprint identification sensor with TSVs having a low aspect ratio.

To guarantee the deposition of sensors on functional surfaces, a reliable thin insulation layer is required. Within this paper, the results of the investigation of a capable insulation layer are presented. Challenges occurring during the manufacturing process will be discussed. A focus is set on parameters that influence the breakdown field strength. The influence of the surface roughness on the quality of the produced layers will be discussed as well. Differences between layers deposited on stainless steel and on aluminium will be mentioned.

One of the most important, yet problematic, issues in the extrusion process is achieving good mixing. Considerable prior efforts have been made to understand different types of mixing elements for single-screw and twin-screw extrusion. However, there is still a lack of good process values or criteria that can be used for design purposes. The focus of this work is to better quantify the mixing behavior, using 3D FEM analysis, to develop some design criteria. This study will focus on the fluted mixer, comparing common design variations and the effect of material viscosity and process conditions.

One of the most important, yet problematic, issues in the extrusion process is achieving good mixing. Considerable prior efforts have been made to understand different types of mixing elements for single-screw and twin-screw extrusion. However, there is still a lack of good process values or criteria that can be used for design purposes. The focus of this work is to better quantify the mixing behavior, using 3D FEM analysis, to develop some design criteria. This study will focus on the fluted mixer, comparing common design variations and the effect of material viscosity and process conditions.

Estriche in Wohn- und Bürogebäuden werden in Mittel- und Nordeuropa überwiegend als Estriche auf Dämmschicht („Schwimmende Estriche“) ausgeführt. Tritt ungewollt Wasser in solchen Räumen aus, gelangt dieses zumindest teilweise unter die Estrichdämmschicht. Dieses Wasser führt zu Schäden an den betroffenen Baustoffen, wie etwa kapillaren Feuchteaufzügen der angrenzenden Wände oder Setzungsbewegungen der Estriche. Außerdem wird befürchtet, dass sich eine mikrobielle Eskalation (Schimmelpilzbildung) in der Dämmschichtebene ereignet. Seit Jahrzehnten wird deshalb versucht, das eingedrungene Wasser durch Einblasen oder Absaugen von Luft aus der Estrichdämmschicht (sog. Technische Trocknung) auszutreiben. In der vorliegenden Arbeit wird gezeigt, welche maßgeblichen Wasserdampf-Transportvorgänge in unterschiedlichen Dämm-Materialien vorherrschen. Durch eine numerische Simulation wird belegt, dass die notwendigen Trocknungszeiten zu groß sind, um ein Auskeimen und Wachsen von Schimmelpilzen zu vermeiden. Mit provozierten Wasserschäden an verschiedenen Estrichaufbauten im Prüfstand wird gezeigt, dass unter realistischen Bedingungen mit einer technischen Trocknung Estrichdämmschichten nicht sicher entfeuchtet werden können. Es ist immer mit einer mikrobiellen Eskalation zu rechnen. Grenzt der durchfeuchtete Estrich an Trockenbauwände aus Gipskartonplatten oder andere Wände mit Tapetenbekleidung, so bilden sich oft Schimmelpilze der toxinbildenden Gattung Stachybotrys chartarum aus. Hier wurde untersucht, ob dann für den Raumnutzer oder den Sanierer eine realistische Vergiftungsgefahr besteht. Im Ergebnis muss der Sanierer die jetzt schon geltenden Vorschriften über persönliche Schutzausrüstungen - wie bei allen anderen Schimmelpilzen auch - einhalten. Für den Raumnutzer besteht keine Vergiftungsgefahr. Um künftig mikrobielle Eskalationen in der Estrichdämmschicht vermeiden zu können, wird in dieser Arbeit eine neue Ventilationsschicht eingeführt. Mit dieser ist eine sichere, Floors of heated solid buildings are mostly constructions of screeds with insulation layers underneath. If a leak occurs, water enters into the section under the insulation layer. This water damages surrounded components, e.g. capillary moisture in the walls or settling of the screeds. Furthermore it is suspected, that a microbial escalation occurs in the insulation layer. Since decades it is attempted that through technical drying (via blow or suction of air) in the insulation layer, the infiltrated water can be casted out. In this thesis it is shown, which water vapour transport processes are significant in different insulating materials. Through a numerical simulation of the drying behavior it is documented, that necessary drying times are too long to avoid germination and growth of microbiological creatures. It is shown in the test bench with provoked water damages on several screed constructions, that under lifelike test conditions, insulation layers under screeds can’t be dried out reliably via technical drying. A microbial escalation can occur at all times. If the water damaged screed construction adjoins a gypsum board wall or a wall with wallpapers, often the toxic fungus Stachybotrys chartarum grows. Here it has been investigated, whether the danger of intoxication for the inhabitants or the remediation workers is real. As a matter of fact, the remediation worker has already to follow safety instructions considering personal protective equipment like for all other fungus species. For inhabitants persists no danger of intoxication., Dipl.-Ing. Univ. Ralf Gebauer, Abweichender Titel laut Übersetzung der Verfasserin/des Verfassers, Dissertation Universität Innsbruck 2017

Estriche in Wohn- und Bürogebäuden werden in Mittel- und Nordeuropa überwiegend als Estriche auf Dämmschicht („Schwimmende Estriche“) ausgeführt. Tritt ungewollt Wasser in solchen Räumen aus, gelangt dieses zumindest teilweise unter die Estrichdämmschicht. Dieses Wasser führt zu Schäden an den betroffenen Baustoffen, wie etwa kapillaren Feuchteaufzügen der angrenzenden Wände oder Setzungsbewegungen der Estriche. Außerdem wird befürchtet, dass sich eine mikrobielle Eskalation (Schimmelpilzbildung) in der Dämmschichtebene ereignet. Seit Jahrzehnten wird deshalb versucht, das eingedrungene Wasser durch Einblasen oder Absaugen von Luft aus der Estrichdämmschicht (sog. Technische Trocknung) auszutreiben. In der vorliegenden Arbeit wird gezeigt, welche maßgeblichen Wasserdampf-Transportvorgänge in unterschiedlichen Dämm-Materialien vorherrschen. Durch eine numerische Simulation wird belegt, dass die notwendigen Trocknungszeiten zu groß sind, um ein Auskeimen und Wachsen von Schimmelpilzen zu vermeiden. Mit provozierten Wasserschäden an verschiedenen Estrichaufbauten im Prüfstand wird gezeigt, dass unter realistischen Bedingungen mit einer technischen Trocknung Estrichdämmschichten nicht sicher entfeuchtet werden können. Es ist immer mit einer mikrobiellen Eskalation zu rechnen. Grenzt der durchfeuchtete Estrich an Trockenbauwände aus Gipskartonplatten oder andere Wände mit Tapetenbekleidung, so bilden sich oft Schimmelpilze der toxinbildenden Gattung Stachybotrys chartarum aus. Hier wurde untersucht, ob dann für den Raumnutzer oder den Sanierer eine realistische Vergiftungsgefahr besteht. Im Ergebnis muss der Sanierer die jetzt schon geltenden Vorschriften über persönliche Schutzausrüstungen - wie bei allen anderen Schimmelpilzen auch - einhalten. Für den Raumnutzer besteht keine Vergiftungsgefahr. Um künftig mikrobielle Eskalationen in der Estrichdämmschicht vermeiden zu können, wird in dieser Arbeit eine neue Ventilationsschicht eingeführt. Mit dieser ist eine sichere, Floors of heated solid buildings are mostly constructions of screeds with insulation layers underneath. If a leak occurs, water enters into the section under the insulation layer. This water damages surrounded components, e.g. capillary moisture in the walls or settling of the screeds. Furthermore it is suspected, that a microbial escalation occurs in the insulation layer. Since decades it is attempted that through technical drying (via blow or suction of air) in the insulation layer, the infiltrated water can be casted out. In this thesis it is shown, which water vapour transport processes are significant in different insulating materials. Through a numerical simulation of the drying behavior it is documented, that necessary drying times are too long to avoid germination and growth of microbiological creatures. It is shown in the test bench with provoked water damages on several screed constructions, that under lifelike test conditions, insulation layers under screeds can’t be dried out reliably via technical drying. A microbial escalation can occur at all times. If the water damaged screed construction adjoins a gypsum board wall or a wall with wallpapers, often the toxic fungus Stachybotrys chartarum grows. Here it has been investigated, whether the danger of intoxication for the inhabitants or the remediation workers is real. As a matter of fact, the remediation worker has already to follow safety instructions considering personal protective equipment like for all other fungus species. For inhabitants persists no danger of intoxication., Dipl.-Ing. Univ. Ralf Gebauer, Abweichender Titel laut Übersetzung der Verfasserin/des Verfassers, Dissertation Universität Innsbruck 2017