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An epoxy–anhydride formulation used for the coating electrical devices was modified with a commercially available hyperbranched poly(ester amide), Hybrane S2200, to improve the thermal degradability of the resulting thermoset and, thus, facilitate the recovery of substrate materials after the service life of the component. The thermomechanical, mechanical, and dielectric properties and thermal degradability were studied and interpreted in terms of the composition and network structure of the cured thermosets. Although the crosslinking density was significantly reduced with the incorporation of S2200, the glass transition temperature of the fully cured material (Tg∞) of the modified thermoset was hardly affected because of the enhancement of H-bonding interactions in the presence of S2200. Despite the different network structures, the combined dielectric and dynamic mechanical analysis revealed that the relaxation dynamics of both networks were very similar. In terms of application, improvements in the dielectric and mechanical properties were observed. The incorporation of S2200 accelerated the thermal decomposition of the material and, thus, facilitated the recovery of the valuable parts from the substrate at the end of the service life of the apparatus, Postprint (published version)

An epoxy-anhydride formulation used for the coating of electrical devices was modified with a commercially available hyperbranched poly(ester-amide), HybraneS2200, in order to improve the thermal degradability of the resulting thermoset and thus facilitate the recovery of substrate materials after use of the component. The curing kinetics of the unmodified and modifiedformulationswerestudied in detail with differential scanning calorimetry,Fourier transform infrared spectroscopyand rheology. The results suggest that S2200 gets incorporated into the network structure and the curing kinetics are accelerated by the presence of hydroxyl groups from S2200., Postprint (published version)

info:eu-repo/semantics/published

Praca magisterska napisana pod kierunkiem prof Józefa Maroszka, ilośćskanów: 144

Praca magisterska napisana pod kierunkiem prof Józefa Maroszka, ilośćskanów: 144

Praca magisterska napisana pod kierunkiem prof Józefa Maroszka, ilośćskanów: 144

Praca magisterska napisana pod kierunkiem prof Józefa Maroszka, ilośćskanów: 144

Thin layers of discotic liquid crystals, p-type: HBC-C8,2, HBC-C12 and n-type: HATNA 4D, RDlSCl and perylene derivative were prepared by drop- and zone-casting. It is shown, that zone-casting yields aligned, anisotropic films with "edge-on" orientation suitable for FET construction. In the isotropic, obtained by drop-casting films the charge-carrier photogeneration, recombination and transport were investigated by means of xerographic discharge. For the first time it is demonstrated experimentally that in the nominally n-type discotics the majority charge carriers are electrons., SCOPUS: cp.j, info:eu-repo/semantics/published

An epoxy–anhydride formulation used for the coating electrical devices was modified with a commercially available hyperbranched poly(ester amide), Hybrane S2200, to improve the thermal degradability of the resulting thermoset and, thus, facilitate the recovery of substrate materials after the service life of the component. The thermomechanical, mechanical, and dielectric properties and thermal degradability were studied and interpreted in terms of the composition and network structure of the cured thermosets. Although the crosslinking density was significantly reduced with the incorporation of S2200, the glass transition temperature of the fully cured material (Tg∞) of the modified thermoset was hardly affected because of the enhancement of H-bonding interactions in the presence of S2200. Despite the different network structures, the combined dielectric and dynamic mechanical analysis revealed that the relaxation dynamics of both networks were very similar. In terms of application, improvements in the dielectric and mechanical properties were observed. The incorporation of S2200 accelerated the thermal decomposition of the material and, thus, facilitated the recovery of the valuable parts from the substrate at the end of the service life of the apparatus, Postprint (published version)