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The results of the current paper present the research concerning the obtaining of Cu-Ag alloys with wt. % of silver ranging between 5 and 20 % using continuous casting process. The process parameters have been introduced. Selected results regarding physical and mechanical properties of the casts have been discussed. Strength coefficients describing the plastic deformation range of the Cu-Ag alloys have been calculated using Hollomon’s equation. Additionally, in order to determine the influence of the temperature with Differential Scanning Calorimeter (DSC) on the electrical resistance, the values of temperature coefficients of resistance have been determined for all of the tested alloys.

This article is devoted to the comparison of changes in mechanical and electrical properties due to the applied deformation of copper and copper alloy rods. Bars from four different production technologies were deformed in the drawing process, including oxygen-free (OF) copper, electrolytic copper ETP, copper from cable granulate and silver copper with a high silver content up to 15 wt. % obtained in laboratory technology. The article presents the chemical purity, physical and electrical properties of rods before deformation. The summary of the research on the selected materials are changes in mechanical properties and electrical conductivity as a function of deformation up to 3,5 on a logarithmic scale and the coefficient of electromechanical efficiency WEM.

Many factors are responsible for the formation of surface and internal defects during copper wire drawing process. Generally they may be divided into defects of material or processing origin. Even input material of the highest quality with little to none defects cannot ensure the absence of breakages during the process due to inadequate process parameters. Optimally selected process parameters may reduce the risk of cracks forming during the metal forming process. The paper presents examples of wire defects and cracks occurring throughout the wire drawing process of copper in industrial conditions and a wide analysis of their source.

The susceptibility to deep processing in the industrial wire drawing process has been investigated in the research paper regarding the copper grade influence on the process. The conducted research included the identification of the mechanical and electrical properties of wires manufactured from Electrolytic Tough Pitch Copper (Cu-ETP) wire rod and Oxygen-Free Copper (Cu-OF) cast rod in terms of the applied deformation. In particular, as main contribution of this research to the scientific and industrial community a mathematical model describing the wire strengthening and softening characteristics was determined.

This article is devoted to the comparison of changes in mechanical and electrical properties due to the applied deformation of copper and copper alloy rods. Bars from four different production technologies were deformed in the drawing process, including oxygen-free (OF) copper, electrolytic copper ETP, copper from cable granulate and silver copper with a high silver content up to 15 wt. % obtained in laboratory technology. The article presents the chemical purity, physical and electrical properties of rods before deformation. The summary of the research on the selected materials are changes in mechanical properties and electrical conductivity as a function of deformation up to 3,5 on a logarithmic scale and the coefficient of electromechanical efficiency WEM.

The susceptibility to deep processing in the industrial wire drawing process has been investigated in the research paper regarding the copper grade influence on the process. The conducted research included the identification of the mechanical and electrical properties of wires manufactured from Electrolytic Tough Pitch Copper (Cu-ETP) wire rod and Oxygen-Free Copper (Cu-OF) cast rod in terms of the applied deformation. In particular, as main contribution of this research to the scientific and industrial community a mathematical model describing the wire strengthening and softening characteristics was determined.

Many factors are responsible for the formation of surface and internal defects during copper wire drawing process. Generally they may be divided into defects of material or processing origin. Even input material of the highest quality with little to none defects cannot ensure the absence of breakages during the process due to inadequate process parameters. Optimally selected process parameters may reduce the risk of cracks forming during the metal forming process. The paper presents examples of wire defects and cracks occurring throughout the wire drawing process of copper in industrial conditions and a wide analysis of their source.