1. Solution for Metal Remain in TFT-LCD Manufacturing Process
- Author
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李炳天 Lee Byung-chun, 李淳东 Lee Soon-dong, and 蒋冬华 Jiang Dong-hua
- Subjects
Liquid-crystal display ,Materials science ,business.industry ,Manufacturing process ,Insulator (electricity) ,Electronic, Optical and Magnetic Materials ,law.invention ,Metal ,Etch pit density ,law ,Thin-film transistor ,visual_art ,Signal Processing ,visual_art.visual_art_medium ,Optoelectronics ,Data lines ,business ,Instrumentation ,Multi layer - Abstract
In 4-mask manufacturing process of the thin film transistor(TFT) liquid crystal display(LCD),multi-layer etch is a very critical process,because metal remain defect would happen after multi-layer etch,which will influence on the next insulator layer deposition,and induce layer broken.Conventional method for eliminating metal remain is to adjust multi-layer etch process,but there is no fundamental improvement.In this paper,the influence of data line etch time on metal remain after multi-layer etch has been researched,and it is found that metal remain could be fundamentally eliminated by adjusting data line etch time,and also could keep data line width in control.
- Published
- 2011