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Supplemental material, sj-docx-1-npx-10.1177_1934578X221098850 for Using Network Pharmacology and Molecular Docking Technology to Explore the Mechanism of Modified Pulsatilla Decoction in the Treatment of Ulcerative Colitis by Tingting Wu, Xin Yang, Bo Xu, Huiping Zhu, Jinwei Guo, Yu Zhou, Guoqiang Liang and Hongwen Sun in Natural Product Communications

Supplemental material, sj-docx-1-npx-10.1177_1934578X221098850 for Using Network Pharmacology and Molecular Docking Technology to Explore the Mechanism of Modified Pulsatilla Decoction in the Treatment of Ulcerative Colitis by Tingting Wu, Xin Yang, Bo Xu, Huiping Zhu, Jinwei Guo, Yu Zhou, Guoqiang Liang and Hongwen Sun in Natural Product Communications

The DICE flip-flop has been rendered ineffective in deep-submicron technology nodes (e.g. 65 nm and 28 nm) due to charge sharing when exposed to single event strikes. This paper presents a new single event upset tolerant flip-flop design by applying the hardening technique on DICE at the layout level. This approach is an alternative to existing Layout Design through Error-Aware Transistor Positioning (LEAP); it also re-places transistors in master and slave DICE latches in the zigzag fashion in the layout. Both computer simulations and heavy-ion experimental results demonstrate that our proposed layout design has no single event upset errors under normal strikes until LET = 37 MeV·cm2/mg compared to the traditional DICE structure.

Ultraviolet nanoimprint lithography (UV-NIL) is an important micro/nano fabrication approach. UV-NIL has the advantage of high solution, high throughput and low cost. However, some inner resist flow mechanism is not completely understood by experimental methods. This contribution used the simulation method based on contact mechanics to analyze the impact of imprint pressure on residual layer thickness (RLT). Seven different pressure, from 0.1 MPa to 0.7 MPa, was applied to imprint the same stamp containing grating patterns with various protrusion density. It was found that RLT is not uniform and the areas with high protrusion density has much higher RLT. The average RLT decreases with imprint time and tends to be stable when the imprint process is completed. Both the maximum and minimum RLT decreases with the increase of imprint pressure. These findings can help engineers to design proper stamp pattern distribution and process parameters. Introduction