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1. Microtrenching-free two-step reactive ion etching of 4H-SiC using NF{sub 3}/HBr/O{sub 2} and Cl{sub 2}/O{sub 2}

Author: Tsui, Bing-Yue [Department of Electronics Engineering, National Chiao Tung University, No. 1001, Daxue Rd., East Dist., Hsinchu City 30010, Taiwan (China)]
Published: 2014
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