60 results on '"Chen, Chuantong"'
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2. Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
3. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
4. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
5. Effects of high temperature and high humidity on the reliability of copper/epoxy bond
6. Effect of Ni addition and bath temperature on electroless Cu microstructure in microvia preparation for HDI substrate
7. Low-temperature copper sinter-joining technology for power electronics packaging: A review
8. Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach
9. Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
10. Size effect of nickel-based single crystal superalloy revealed by nanoindentation with low strain rates
11. Effect of thermal-mechanical conditions on strength of silanized Al alloy/CFRTP hybrid joint made by thinning-controlled hot pressing
12. Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications
13. Al heat affected zone-less resistance element welded lap joints of Al alloy and 1 GPa class steel: Transition of microstructure and fracture with heat transfer
14. Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations
15. Pressureless sinter-joining of micron-Ag flake pastes at 160 °C enabled by solvent and interface engineering
16. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
17. Effect of nanosecond pulsed laser parameters on texturing formation of metallic surface: Experiment and modelling
18. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
19. Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
20. Interfacial microstructures and corrosion behavior of tungsten heavy alloy/superalloy dissimilar joints: design, regulation and mechanism
21. Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives
22. Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution
23. Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests
24. Effect of thermal condition on isothermal-pressing joined strength of silanized Al alloy/carbon fiber-reinforced polyamide-6
25. Unveiling the damage evolution of SAC305 during fatigue by entropy generation
26. Improving bonding strength of Al/CFRTP hybrid joint through modifying friction spot joining tools
27. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
28. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
29. Effect of Mg remelting and mechanical hooks of steel on the mechanical and fatigue responses of resistance element welded AZ31/DP780 joints: Experimental, FEM and thermodynamic calculation studies
30. Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability
31. Development of anti-oxidation Ag salt paste for large-area (35 [formula omitted] 35 mm2) Cu-Cu bonding with ultra-high bonding strength
32. Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure
33. Robust bonding and microstructure behavior of aluminum/high-strength steel lap joints using resistance element welding process for lightweight vehicles: Experimental and numerical investigation
34. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
35. The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film
36. Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste
37. Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
38. Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions
39. Fracture mechanism and strength evaluation of Al5052/CFRP joint produced by coaxial one-side resistance spot welding
40. Reactive wafer bonding with nanoscale Ag/Cu multilayers
41. 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste
42. Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating
43. Self-assembled layer as an effective way to block copper diffusion into epoxy
44. Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition
45. Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size
46. Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules
47. Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
48. Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size
49. Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
50. Copper diffusion into epoxy under high temperature
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