75 results on '"Gessner T"'
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2. Quantum dot-based sensor layer in lightweight structures
3. Reactivity to combined experimental stress- and alcohol cue-exposure predicts real-life alcohol use and craving in individuals with alcohol use disorder
4. A novel technique for MEMS packaging: Reactive bonding with integrated material systems
5. Micro arc welding for electrode gap reduction of high aspect ratio microstructures
6. Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
7. Influence of the additives argon, O 2, C 4F 8, H 2, N 2 and CO on plasma conditions and process results during the etch of SiCOH in CF 4 plasma
8. Simulation of TaN x deposition by Reactive PVD
9. Compact meta-material transmission line balun based on meander lines structure and MEMS technology
10. Analysis of the impact of different additives during etch processes of dense and porous low- k with OES and QMS
11. Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation
12. Roughness improvement of the CoSi 2/Si-interface for an application as buried silicide
13. Evaluation of air gap structures produced by wet etch of sacrificial dielectrics: Extraction of keff for different technology nodes and film permittivity
14. Cu/barrier CMP on porous low- k based interconnect schemes
15. Different approaches to integrate patterned buried CoSi 2 layers in SOI substrates
16. A spectral vibration detection system based on tunable micromechanical resonators
17. Impact of reducing resist stripping processes at elevated temperature on ULK and HM materials
18. Different SiH 4 treatments of CVD TiN barrier layers
19. Fabrication and characterization of buried silicide layers on SOI substrates for BICMOS-applications
20. Scaling down thickness of ULK materials for 65 nm node and below and its effect on electrical performance
21. The current limits of the laser-acoustic test method to characterize low- k films
22. Novel low- k polycyanurates for integrated circuit (IC) metallization
23. Me 3SiC [tbnd]C–CMe [dbnd]CH 2 copper(I) β-diketonates: Synthesis, solid state structure, and low-temperature chemical vapour deposition
24. Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials
25. Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility
26. SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes
27. Influence of SiH 4 on the WN x-PECVD process
28. CVD TiN layers as diffusion barrier films on porous SiO 2 aerogel
29. In situ high temperature synchrotron-radiation diffraction studies of silicidation processes in nanoscale Ni layers
30. Thermal conductivity of ultra low- k dielectrics
31. Experimental results on the integration of copper and CVD ultra low k material
32. Effect of annealing on the microstructure of ultrathin tungsten nitride diffusion barriers for copper metallization
33. Development of PECVD WN x ultrathin film as barrier layer for copper metallization
34. Investigation of long throw PVD of titanium films from polycrystalline targets with texture
35. Comparison of techniques to characterise the density, porosity and elastic modulus of porous low- k SiO 2 xerogel films
36. Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems
37. Silicon oxide in SiSi bonded wafers
38. A single-crystal Si-resonator with on-chip readout amplifier in standard CMOS
39. Comparative study of Cu and CuAl 0.3 wt.% films
40. Optical properties and mechanical stress in SiO 2/Nb 2O 5 multilayers
41. A deconvolution of the transient response of (1 0 0) Si/SiO 2 semiconductor–insulator interface states according to small pulse excitation: evidence of different branches of charge transition
42. A study of the interface states in MIS-structures with thin SiO 2 and SiO xN y layers using deep level transient spectroscopy
43. A new technology platform for fully integrated polymer based micro optical fluidic systems
44. Chapter 8 - Spin-on Si-based low-k materials
45. Chapter 7 - Chemical vapor deposition of C-F low-k materials
46. Conference organization
47. Ohmic contacts to n-type polycrystalline SiC for high-temperature micromechanical applications
48. Film stress measurements for high temperature micromechanical and microelectronical applications based on SiC
49. Growth rate modeling for selective tungsten LPCVD
50. Evaluation of selective tungsten plugs on TiN, W and AlSi by analytical and electrical measurements
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