21 results on '"Wang, Tongqing"'
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2. An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data
3. A reinforcement ensemble deep transfer learning network for rolling bearing fault diagnosis with Multi-source domains
4. Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy
5. Behavioral feature recognition of multi-task compressed sensing with fusion relevance in the Internet of Things environment
6. RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
7. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning
8. A high capacity reversible data hiding scheme based on right-left shift
9. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
10. Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization
11. Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
12. Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
13. Chemical effects on the tribological behavior during copper chemical mechanical planarization
14. Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry
15. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer
16. Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing
17. In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
18. Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
19. Effect of a Cu seed layer on electroplated Cu film
20. Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
21. A status report of the ISOL facility in Lanzhou
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