24 results on '"Chen, Chuantong"'
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2. Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests
3. Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test
4. Improved thermal cycling reliability of Ag sinter joining by optimized chip mounting speed and push depth
5. Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses
6. Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature
7. Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules
8. Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
9. Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint
10. Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish
11. Effect of annealing Co-W-P metallization substrate onto its resin adhesion
12. CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins
13. Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics
14. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
15. Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release
16. Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors
17. Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules
18. Solid porous Ag–Ag interface bonding and its application in the die-attached modules
19. High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device
20. Electrochemical Behavior of Sn-9Zn-xTi Lead-Free Solders in Neutral 0.5M NaCl Solution
21. High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates
22. Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates
23. Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
24. Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices
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