4 results on '"Choe, Chanyang"'
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2. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
3. Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors
4. Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules
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