55 results on '"Lee, Hyuck"'
Search Results
2. Decision Making for Collision Avoidance Systems Considering a Following Vehicle
3. Intimate atomic Cu-Ag interfaces for high CO2RR selectivity towards CH4 at low over potential
4. Microstructure Modification of Liquid Phase Sintered Fe–Ni–B–C Alloys for Improved Mechanical Properties
5. Accelerated mapping of electronic density of states patterns of metallic nanoparticles via machine-learning
6. Highly active and stable stepped Cu surface for enhanced electrochemical CO2 reduction to C2H4
7. Wireless bioresorbable electronic system enables sustained nonpharmacological neuroregenerative therapy
8. A combinatorial approach for the synthesis and analysis of AlxCryMozNbTiZr high-entropy alloys: Oxidation behavior
9. Perovskite-polymer composite cross-linker approach for highly-stable and efficient perovskite solar cells
10. Design of emergency braking algorithm for pedestrian protection based on multi-sensor fusion
11. Predictive risk factors for Listeria monocytogenes meningitis compared to pneumococcal meningitis: a multicenter case–control study
12. Uniform thin film electrode made of low-temperature-sinterable silver nanoparticles: optimized extent of ligand exchange from oleylamine to acrylic acid
13. Fabrication of sintering-free flexible copper nanowire/polymer composite transparent electrodes with enhanced chemical and mechanical stability
14. Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
15. Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors
16. Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions
17. Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders
18. Is adjunctive corticosteroid beneficial in pneumococcal meningitis in a region with high rates of resistance to penicillin and ceftriaxone?
19. Synthesis and characterization of highly conductive Sn–Ag bimetallic nanoparticles for printed electronics
20. A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics
21. Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C
22. Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints
23. Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
24. The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy
25. Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging
26. Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate
27. An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
28. Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
29. Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM
30. Undercooling and microhardness of Pb-free solders on various under bump metallurgies
31. Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging
32. Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System
33. Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging
34. Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering
35. Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging
36. Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging
37. Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint
38. Molecular dynamics simulation of zigzag single-walled carbon nanotube closing mechanisms
39. A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system
40. Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint
41. Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
42. Alloy design of intermetallic dispersion strengthened aluminum systems by mechanical alloying for high temperature applications
43. Relationship between domain structure and film thickness in epitaxial PbTiO3 films deposited on MgO(001) by reactive sputtering
44. Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate
45. Investigation of the phase equilibria in the Sn-Bi-In alloy system
46. Thermodynamic prediction of interface phases at Cu/solder joints
47. M2C precipitates in isothermal tempering of high Co-Ni secondary hardening steel
48. Alloy design and coarsening phenomenon of L12 precipitates in high-temperature Al-2 At. Pct (Ti,V,Zr) systems
49. Grain Morphology of Intermetallic Compounds at Solder Joints
50. Coarsening resistance of M2C carbides in secondary hardening steels: Part III. Comparison of theory and experiment
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.