6 results on '"Rzepka, Sven"'
Search Results
2. Quantitative Determination of the Mechanical Stresses in BEoL Films and Structures on Si Wafers with Sub-micron Spatial Resolution by fibDAC
3. The effects of underfill on the reliability of flip chip solder joints
4. The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach
5. FEM Analysis of Thermal Stresses in Advanced Electronic Packages
6. Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.