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3. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package

4. Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

5. Corrosion Under Insulation (CUI) Monitoring: Improvise a Smart Way to Detect CUI

6. Effect of Volatile Corrosion Inhibitor Dosage Towards Top and Bottom of the Line Corrosion

7. Corrosion Behavior of Aluminum Alloys in Hydrogen Chloride Containing Environments

8. Producing Blast Furnace Slag Cement Clinker by Utilizing Redox Reaction Approach

9. High Temperature Oxidation of T91 Alloy of Steam Reformer

10. Mechanical and Corrosion Properties Investigation of Sn-9Zn Solder with the Additions of Nickel-Coated Precipitated Calcium Carbonate

11. Effect of Hydrogen Sulfide and Chloride on the Passive Film Structures of Stainless Steel Type 316L

12. Effect of Water Resistivity and Coating Material for Cathodic Protection System to Achieve Cathodic Protection Criteria

13. The Influence of Sulphate-Reducing Bacteria on Surface Characterisation of Carbon Steel in CO2 Environment

14. Effectiveness of Sodium Dodecylbenzene Sulfonate and Zinc Sulfate as Corrosion Inhibitors for Mild Steel in Sodium Chloride Solution

15. Electrochemical Studies of Date Palm Seed as a Green Corrosion Inhibitor for Carbon Steel in 0.5 M H2SO4 and CH3COOH Conditions

16. Electrochemical Monitoring of Oxygen Potential on Fe-Cr Alloy Surface During High Temperature Oxidation in Dry and Humid Conditions

17. High-Temperature Corrosion of Hot-Dipped Aluminizing on Carbon Steel in Dry and Wet Environments

18. Electrochemical Characterization of Cleaning Nickel Foam Current Collector for Supercapacitor Application

19. Electrochemical Impedance Spectroscopy (EIS) Analysis of Green Corrosion Inhibitor of Etlingera Elatior Extracts for Mild Steel in Acidic Media

20. Effect of Graphite Particles on Corrosion Resistance Behaviour of Palm Oil-Based UV-Curable Coating

21. Effect of Hydrolysed Polyacrylamide Towards MIC Bacteria Growth and MIC Corrosion Rates

22. Green Corrosion Inhibition of Mild Steel by Xylopia ferruginea in 1 M HCl Solution

23. Top of Line Corrosion (TLC) Behaviour with Presence of Gas Condensate in CO2 Wet Gas Pipeline

24. Assessment of Corrosion on Buried Metallic Pipeline Induced by AC Interference Below High Transmission Line

25. Metal Dusting Led Failure in a High-Temperature Condenser

26. Flux Modification for Wettability and Reliability Improvement in Solder Joints

27. The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental

28. Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations

29. Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders

30. The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth

31. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering

32. Tin Whiskers Growth in Electronic Assemblies

33. Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

34. Development of Geopolymer Ceramic-Reinforced Solder

35. Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements

36. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process

37. Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder

38. Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi

39. Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste

40. Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics

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