1. Dynamic Thermal Management in SOI Transistors Using Holey Silicon-Based Thermoelectric Cooling
- Author
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Luo, Jiajian, Lim, Jungyun, Chen, Jingjing, Venugopal, Archana, Ren, Zongqing, and Lee, Jaeho
- Abstract
Silicon-on-insulator (SOI) technology offers many advantages for transistors while also presenting significant challenges in thermal management. The buried oxide (BOX) layer impedes vertical heat dissipation, rendering conventional cooling solutions based on air and liquid coolers inefficient. In this study, we propose a novel theoretical design of a holey silicon-based lateral thermoelectric cooler (TEC) that provides a unique cooling solution for SOI transistors. By redistributing heat laterally, this TEC overcomes the limitation of poor vertical heat dissipation caused by the BOX layer, meanwhile taking advantage of the sustained temperature gradient in the device layer. In addition, we present a novel precooling strategy which utilizes a long-time, optimal-voltage TEC cooling pulse to cool down a short-time, high-power-density heating pulse. We evaluate the cooling performance through simulation of two devices: an SOI transistor-TEC device and a
$5\times5$ $\mu \text{s}$ $\mu \text{m}$ $\Delta {T}$ $\mu \text{s}$ - Published
- 2024
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