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The cryogenic operation of power converters integrated with the superconducting electric machines can leverage the lower parasitic, lower core material, and insulation requirement to reduce weight and increase power density in aerospace applications. To that end, Gallium Nitride High Electron Mobility Transistor (GaN HEMT) has recently proven to be the most viable option for the cryogenic converter operation. However, the topology selection and optimization are greatly influenced by the current/voltage rating of the power devices. Although series connected HEMTs can increase the blocking voltage, the dynamic voltage imbalance issue stemming from device parameter fluctuations, the larger number of required isolated gate driver makes the need for single high blocking voltage devices more compelling. This is even more pronounced in GaN due to its higher operating frequency which stems from the lower input capacitance. Although 900V cascode GaN HEMTs are now commercially available, single-chip high voltage HEMTs are attractive due to their zero reverse recovery charge, and lower package bonding parasitics. In this paper, a 1200V enhancement-mode GaN HEMT from GaNPower International has been characterized at cryogenic temperature. A 63% decrease has been demonstrated in the on-resistance, Rds(on)from room temperature to -150°C. The threshold voltage shows a 1.2x increase from room temperature to cryogenic temperature (-178°C). The transconductance (Gfs) shows a 1.34x increase for a temperature difference of 175°C. The results translate to a lower conduction loss and a faster switching speed and unfold further possibility of GaN in cryogenic converter applications.