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3. A > 64 Multiple States and > 210 TOPS/W High Efficient Computing by Monolithic Si/CAAC-IGZO + Super-Lattice ZrO2/Al2 O3/ZrO2 for Ultra-Low Power Edge AI Application

4. Development of Highly Manufacturable, Reliable, and Energy-Efficient Spin-Orbit Torque Magnetic Random Access Memory (SOT-MRAM)

6. Novel Analog in-Memory Compute with > 1 nA Current/Cell and 143.9 TOPS/W Enabled by Monolithic Normally-off Zn-rich CAAC-IGZO FET-on-Si CMOS Technology

9. Strain enhanced low-VT CMOS featuring La/Al-doped HfSiO/TaC and 10ps invertor delay

10. Low VT metal-gate/high-k nMOSFETs — PBTI dependence and VT Tune-ability on La/Dy-capping layer locations and Laser annealing conditions

11. Electrical Properties of Low-$V_{T}$ Metal-Gated n-MOSFETs Using $\hbox{La}_{2}\hbox{O}_{3}/\hbox{SiO}_{x}$ as Interfacial Layer Between HfLaO High-$\kappa$ Dielectrics and Si Channel

12. Cost-Effective Low $V_{t}$ Ni-FUSI CMOS on SiON by Means of Al Implant (pMOS) and $\hbox{Yb}{+}\hbox{P}$ Coimplant (nMOS)

13. Achieving Low-$V_{T}$ Ni-FUSI CMOS by Ultra-Thin $\hbox{Dy}_{2}\hbox{O}_{3}$ Capping of Hafnium Silicate Dielectrics

15. Demonstration of Metal-Gated Low $V_{t}$ n-MOSFETs Using a Poly-$\hbox{Si/TaN/Dy}_{2}\hbox{O}_{3}/\hbox{SiON}$Gate Stack With a Scaled EOT Value

16. Strain enhanced FUSI/HfSiON Technology with optimized CMOS Process Window

17. Nitrogen Profile and Dielectric Cap Layer (Al2O3, Dy2O3, La2O3) Engineering on Hf-Silicate

18. Achieving low VT Ni-FUSI CMOS via lanthanide incorporation in the gate stack

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