56 results on '"Chien, Wei-Ting Kary"'
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2. A Study On The Dielectric Intrinsic Breakdown Specification
3. Integrating Reliability into Microelectronics Manufacturing
4. Burn-in Performance, Cost, and Statistical Analysis
5. Basic Reliability Concept
6. Reliability, Yield, and Stress Burn-In
7. The Dirichlet Process for Reliability Analysis
8. Reliability Stress Tests
9. Software Reliability and Infant Mortality Period of the Bathtub Curve
10. Nonparametric Approach and Its Applications to Burn-in
11. Yield and Modeling Yield
12. Nonparametric Bayesian Approach for Optimal Burn-in
13. Parametric Approaches To Decide Optimal System Burn-in Time
14. Overview of Design, Manufacture, and Reliability
15. Nonparametric Reliability Analysis
16. Determine optimal burn-in time for highly integrated circuit systems
17. AdaBalGAN: An Improved Generative Adversarial Network With Imbalanced Learning for Wafer Defective Pattern Recognition
18. Fast Semiconductor Reliability Assessments Using SPRT
19. The Competing Aging Effects on SRAM Operating Life Tests
20. Statistical Process Control for Monitoring the Particles With Excess Zero Counts in Semiconductor Manufacturing
21. Investigations and detections on a new BEOL dielectric failure mechanism at advanced technologies
22. The applications of FIB 3-point localization method in semiconductor failure analyses
23. Advanced delayer methods for TEM sample preparations
24. Exploration of baking temperature effects on 28 nm BEOL reliability
25. A study for big-data (Hadoop) application in semiconductor manufacturing
26. A method to group reliability data by hierarchical clustering
27. Influence of I/O oxide process on the NBTI performance of 28nm HfO2-based HKMG p-MOSFETs
28. Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
29. Performance enhancement of ILD by reducing residues during contact W CMP
30. Reliability improvement based on silicon nitride MIM capacitors for mixed-signal and RF applications
31. Resolving plasma induced damage for a CMOS embedded-OTP technology
32. Wafer level package wafer probing shift error-proof quality control
33. The investigation of semiconductor shipping bag reliability
34. Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index
35. Comprehensive Wafer Level Package Die Processing Service quality control enhancement
36. The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics
37. Reliability Baseline Management and Applications in Semiconductor Manufacturing
38. Board level reliability enhancements for wafer level package
39. Ultra low-K CPI evaluations for foundry backend and assembly saw processes
40. Employing optimal experimental design to optimize the accelerated life test plan for TDDB
41. Early detection for quality and reliability management
42. Productive Polishing TEM Sample Preparation Methodology Development
43. An enhancement for single sampling plan method
44. A study on the statistical comparison methods for engineering applications
45. A study on the relationship between pad surface fluorine concentration and the formation of pad corrosion defect
46. Early failure model analysis and improvement of the upstream electromigration in 45nm Cu low-k interconnects
47. Editorial: Reduce Time-to-Market by Considering Reliability Tradeoffs
48. Impact of FIB parameters on TEM sample preparation for low-k process
49. A Practical, Innovative Method for Electro-Static Discharge Data Analysis
50. Failure rate calculation: Extending JESD74/JESD74A to any sample size
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