186 results on '"Jalar, Azman"'
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2. Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging
3. Linear growth behaviour of intermetallic compound layer in electronic interconnections
4. Study on Rare Earth Modified Co Based Composite Powder and its Effects on the Microstructure and Properties of Cemented Carbide
5. Effect of Deformation Temperature on the Dynamic Recrystallization Mechanism and Dynamic Precipitation Behavior of Mg-Gd-Nd-Zr Alloy
6. Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework
7. Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications
8. Unleashing the potential of gallium oxide: A paradigm shift in optoelectronic applications for image sensing and neuromorphic computing applications
9. Effect of Ultrasonic Process Parameter on Resistance and Plastic Deformation of the Aluminum Ribbon Bond on Molybdenum Layer
10. Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component
11. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package
12. Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package
13. Dynamic precipitation and dynamic recrystallization behaviors of Mg-Gd-Nd-Zr magnesium alloy during thermal compression deformation
14. Measurement of Aluminium Remnant Thickness on Copper Wire Bonding using 3D Laser Scanning Microscope
15. Effect of Nd on microstructure and mechanical properties of Mg-7Gd-0.5Zr alloy
16. Real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid COVID-19 detection
17. Dynamic Precipitation and Dynamic Recrystallization Behaviors of Mg-Gd-Nd-Zr Magnesium Alloy During Thermal Compression Deformation
18. Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
19. Early Corrosion Detection of Cu-Ag Wedge bonding in Semiconductor Package
20. Temperature Cycling Test on Ultrasonic Aluminum Bonds and Conductive Adhesive of Copper Indium Gallium (di)Selenide (CIGS) Thin-Film Photovoltaic Solar Panel
21. INFLUENCE OF THERMOMECHANICAL PROCESSING ON MICROMECHANICAL PROPERTIES OF SN-0.7CU SOLDER ALLOY VIA NANOINDENTATION APPROACH
22. EVOLUTION OF DISCRETE SEMICONDUCTOR COPPER WEDGE BOND IN BIASED TEMPERATURE HUMIDITY CHAMBER
23. Voltage Bias Enhancement for Leakage Test on Discrete Products to Detect Low Contact
24. Intermetallic Compound Thickness of Ball Grid Array Solder Joints Under Thermal Cycling Test Using ANOVA
25. Effects of Underfill Materials on Behavior of Intermetallic Compound Thickness of Ball Grid Array Solder Joints Using ANOVA
26. Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
27. Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages
28. TEMPERATURE-INDUCED THICKNESS REDUCTION OF MICROMECHANICAL PROPERTIES OF Sn-0.7Cu SOLDER ALLOY
29. Magnesium-Doped ZnO Nanorod Electrolyte–Insulator–Semiconductor (EIS) Sensor for Detecting Organic Solvents
30. Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach
31. Effect of alloy particle size and stencil aperture shape on solder printing quality
32. Effect of heat shield locations on rework- induced thermal management in ball grid array solder joint
33. Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package
34. EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg3Cu0.5 solder
35. Magnesium-doped ZnO nanorod electrolyte–insulator–semiconductor (EIS) sensor for detecting calcium ions
36. Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach
37. Effect of Nd on Microstructure and Mechanical Properties of Mg-7gd-0.5zr Alloy
38. Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu
39. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel
40. The Effect of Electrolytic Deflash Current on Delamination of Epoxy Mold Compound During Tin Plating Process
41. Elucidation of Metal Etching Defects Through the Experimental Design Process Characterization at Encapsulation and Electro-deflashing Processes
42. Calcium ion-selective electrode based on the facile synthesis of CuO over Cu wires
43. EFFECT OF GAMMA RADIATION ON MICROMECHANICAL BEHAVIOR OF SNPB SOLDER ALLOY
44. Incorporation of Big Data in Methodology of Identifying Corrosion Factors in the Semiconductor Package
45. The Effect of Blast Exposure Distance on Hardness and Reduced Modulus Properties of Lead-Free Solder
46. Effect of Gamma Radiation on Micromechanical Behaviour of SAC305 Solder
47. Low-cost fabrication of a pH sensor based on writing directly over parchment-type paper with pencil
48. Effect of Ultrasonic Bonding Parameters on the Contact Resistance and Bondability Performances of CIGS Thin Film Photovoltaic Solar Panel
49. Zinc Oxide Nanorod Electrolyte–Insulator– Semiconductor Sensor for Enhanced 2-Methoxyethanol Selectivity
50. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes
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