41 results on '"Kim, Hyoungjae"'
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2. Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad
3. Material Removal Model for Lapping Process Based on Spiral Groove Density
4. Ultrahigh Power Output from Triboelectric Nanogenerator Based on Serrated Electrode via Spark Discharge
5. Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping
6. Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process
7. Effect of Relative Surface Charge of Colloidal Silica and Sapphire on Removal Rate in Chemical Mechanical Polishing
8. Self-dressing effect using a fixed abrasive platen for single-sided lapping of sapphire substrate
9. Effect of Crystal Orientation on Material Removal Characteristics in Sapphire Chemical Mechanical Polishing
10. Effects of Groove Shape Dimension on Lapping Characteristics of Sapphire Wafer
11. Effect of platen shape on evolution of total thickness variation in single-sided lapping of sapphire wafer
12. A Study on Pressure Distribution for Uniform Polishing of Sapphire Substrate
13. Study on the Lapping Characteristics of Sapphire Wafer by using a Fixed Abrasive Plate
14. A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP
15. Characterization of diamond wire-cutting performance for lifetime estimation and process optimization
16. Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing
17. Development of green CMP by slurry reduction through controlling platen coolant temperature
18. The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer
19. Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw
20. Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires
21. The Effects of Frequency Lowering Function Hearing Aids on Korean Word Recognition Scores in the High Frequency Hearing Impaired
22. A hybrid polysilicon planarization for suppressing dishing defects
23. Effect of Process Parameters on Particle Removal Efficiency in Poly(vinyl alcohol) Brush Scrubber Cleaning
24. Effect of Process Parameters on Particle Removal Efficiency in Poly(vinyl alcohol) Brush Scrubber Cleaning
25. Effect of mechanical factor in uniformity for electrochemical mechanical planarization
26. Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization
27. Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
28. Kinematical Modeling of Pad Profile Variation during Conditioning in Chemical Mechanical Polishing
29. Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing
30. Local/global planarization of polysilicon micropatterns by selectivity controlled CMP
31. Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization
32. Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing
33. Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry
34. Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits
35. Investigation of polishing characteristics of shallow trench isolation chemical mechanical planarization with different types of slurries
36. Mathematical modeling of CMP conditioning process
37. Heat and its effects to chemical mechanical polishing
38. Fixed Abrasive Pad with Self-conditioning in CMP Process
39. Tribological Effect of Abrasives on Material Removal in Oxide CMP(Surface and edge finishing)
40. Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization
41. Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing
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