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8. A Comprehensive Reliability Characterization of 5G SoC Mobile Platform Featuring 7nm EUV Process Technology

9. Reliability of Industrial grade Embedded-STT-MRAM

10. 1Gbit High Density Embedded STT-MRAM in 28nm FDSOI Technology

11. Reliability of 8Mbit Embedded-STT-MRAM in 28nm FDSOI Technology

15. Considering physical mechanisms and geometry dependencies in 14nm FinFET circuit aging and product validations

19. High performance 32nm logic technology featuring 2nd generation high-k + metal gate transistors

22. A 32nm logic technology featuring 2nd-generation high-k + metal-gate transistors, enhanced channel strain and 0.171μm2 SRAM cell size in a 291Mb array

23. Dielectric breakdown in a 45 nm high-k/metal gate process technology

24. BTI reliability of 45 nm high-K + metal-gate process technology

26. A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging

36. Erratic fluctuations of sram cache vmin at the 90nm process technology node

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