54 results on '"Spelt, Jan K."'
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2. Inertial particle separation in helical channels: A calibrated numerical analysis
3. Inertial particle separation in helical channels: A calibrated numerical analysis
4. Lab on a rod: Size-based particle separation and sorting in a helical channel
5. Durability
6. Inertial particle separation in helical channels: A calibrated numerical analysis
7. Lab on a rod: Size-based particle separation and sorting in a helical channel
8. Comparison of DEM predictions and measured wall-media contact forces and work in a vibratory finisher
9. Measurements of wall-media contact forces and work in a vibratory finisher
10. Aerodynamic focusing of an abrasive air jet and its effect on machining resolution
11. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part II—machining rates and CFD modeling
12. Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part I – adhesive creep data
13. Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part II – Joint measurements and FEA
14. Jet properties and mixing chamber flow in a high-pressure abrasive slurry jet: part I—measurement of jet and chamber conditions
15. Influence of process parameters on average particle speeds in a vibratory finisher
16. Bulk mass flow in a vibratory finisher: mechanisms and effect of process parameters
17. Predicting delamination in multilayer composite circuit boards with bonded microelectronic components
18. Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
19. Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling
20. Load Sharing Between Discrete Solder Joints in Bending: Effect of Spacing and Joint Properties
21. Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
22. Fracture load prediction of BGA solder joints: Cohesive zone modeling and experimental verification
23. Effect of entrained air in abrasive water jet micro-machining: Reduction of channel width and waviness using slurry entrainment
24. Effect of Solder Joint Length on Fracture Under Bending
25. Combined effect of strain-rate and mode-ratio on the fracture of lead-free solder joints
26. High pressure abrasive slurry jet micro-machining using slurry entrainment
27. Abrasive waterjet micro-machining of channels in metals: Model to predict high aspect-ratio channel profiles for submerged and unsubmerged machining
28. Comparison of solder joint fracture behavior in Arcan and DCB specimens
29. Effect of processing parameters on fracture toughness of lead-free solder joints
30. Finite element continuum modeling of vibrationally-fluidized granular flows
31. Electrochemical slurry jet micro-machining of tungsten carbide with a sodium chloride solution
32. Abrasive waterjet micro-machining of channels in metals: Comparison between machining in air and submerged in water
33. Micro-Machining of Channels using a High Pressure Abrasive Slurry Jet Machine (HASJM)
34. Particle impact velocities in a vibrationally fluidized granular flow: Measurements and discrete element predictions
35. Surface Finishing of Micro-channels Using Low Kinetic Energy Abrasives
36. Development of a laser displacement probe to measure particle impact velocities in vibrationally fluidized granular flows
37. Quasi‐Static Fracture Tests
38. Prediction of pad cratering fracture at the copper pad – Printed circuit board interface
39. Characterisation and comparison of microfluidic chips formed using abrasive jet micromachining and wet etching
40. Effect of geometry on the fracture behavior of lead-free solder joints
41. Mixed-mode fracture load prediction in lead-free solder joints
42. Fracture load prediction of lead-free solder joints
43. R-curve behavior of Cu–Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure
44. Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints
45. Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
46. Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle Parameters
47. Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
48. Tribological behavior of aluminum alloys in a vibratory finishing process
49. Adhesive Joint Durability Assessed Using Open-faced Peel Specimens
50. Copper and Copper-Nickel Alloys as Zebra Mussel Antifoulants
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