114 results on '"Wang, Tongqing"'
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2. Publisher Correction to: Computational investigation of a novel metal thickness measurement system with coaxial triple‑coil sensor for chemical mechanical polishing
3. Computational investigation of a novel metal thickness measurement system with coaxial triple-coil sensor for chemical mechanical polishing
4. Developing an Efficient Forward Design Method for Co Post-CMP Cleaning Formulations Based on Nanoparticle Removal Mechanisms
5. Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing
6. Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
7. Roles of Phthalic Acid and Oleic Acid on Chemical Mechanical Polishing in Alkaline Slurries for Cobalt Interconnects
8. Slurry System Establishment And Optimization For Advanced Cobalt Interconnect Metallization
9. The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects
10. The Role of Diethanolamine on Chemical Mechanical Polishing in Alkaline Glycine-Based Slurries for Cobalt Interconnects
11. Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
12. Research on Polishing Mechanisms of Various Surfactants in Chemical Mechanical Polishing Relevant to Cobalt Interconnects
13. Research on weakly alkaline bulk slurries relevant to chemical mechanical polishing for cobalt interconnects
14. Metal thickness measurement system based on a double-coil eddy-current method with characteristic ratio detection
15. Research on Polishing Mechanisms of Various Surfactants in Chemical Mechanical Polishing Relevant to Cobalt Interconnects
16. Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing
17. Defect Law of Cu/Co Patterned Wafers After Using a Novel Bulk/Barrier Slurry and Cleaning Solution
18. Mechanism Analyses of Megasonic and Brush on Post Si Cmp Cleaning Process
19. An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data
20. A reinforcement ensemble deep transfer learning network for rolling bearing fault diagnosis with Multi-source domains
21. Thickness Measurement Based on Eddy Current Sensor With Coaxial Double Coil for Chemical Mechanical Polishing
22. The Role of Diethanolamine on Chemical Mechanical Polishing in Alkaline Glycine-Based Slurries for Cobalt Interconnects
23. LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA
24. Exploiting interaction of fine and coarse features and attribute co-occurrence for person attribute recognition
25. Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy
26. Integrated Silicon Photonics Transmitter in 400GBASE-DR4 QSFP-DD Transceiver
27. An Automatic Thresholding for Crack Segmentation Based on Convex Residual
28. Crack Image Enhancement of Track Beam Surface Based on Nonsubsampled Contourlet Transform
29. Erratum: Galvanic corrosion inhibitors for Cu/Ru couple during chemical mechanical polishing of Ru [ ECS J. Solid-State Sci. Technol., 7, P62 (2017)]
30. Behavioral feature recognition of multi-task compressed sensing with fusion relevance in the Internet of Things environment
31. Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers
32. RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
33. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning
34. A high capacity reversible data hiding scheme based on right-left shift
35. Expression of IL-23R and IL-17 and the pathology and prognosis of urinary bladder carcinoma
36. Micro-galvanic corrosion of Cu/Ru couple in potassium periodate (KIO 4 ) solution
37. A Motif-based Mission Planning Method for UAV Swarms Considering Dynamic Reconfiguration
38. Role of the Adhesion Force during Copper Chemical Mechanical Planarization
39. Chemical Mechanical Polishing of Inlaid Copper Structures with Ru/Ta/TaN as Barrier/Liner Layer
40. Reversible data hiding scheme based on significant‐bit‐difference expansion
41. A theoretical model incorporating both the nano-scale material removal and wafer global uniformity during planarization process
42. Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS
43. Effect of α-receptor blockers on lower urinary tract symptoms, sexual function and quality of life in young and middle-aged men with benign prostatic hyperplasia
44. Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process
45. A frequency-response-based method of sound velocity measurement in an impedance tube
46. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
47. Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru
48. Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS
49. Supplementary material to "Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS"
50. Effects of catalyst concentration and ultraviolet intensity on chemical mechanical polishing of GaN
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