7 results on '"Sebastian Engelmann"'
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2. High-throughput photonic packaging.
3. A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications.
4. A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides.
5. Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides.
6. An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides.
7. Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability.
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