1. 3D MEMS circuits integration for RF and millimeterwave communications
- Author
-
M.N. Do, B. Ducarouge, S. Melle, A. Coustou, Patrick Pons, J.P. Busquere, David Dubuc, Katia Grenier, Robert Plana, Laurent Mazenq, and F. Bouchriha
- Subjects
Microelectromechanical systems ,business.industry ,Computer science ,Electrical engineering ,Hardware_PERFORMANCEANDRELIABILITY ,Silicon based ,Hardware_GENERAL ,Feature (computer vision) ,Microsystem ,Extremely high frequency ,Hardware_INTEGRATEDCIRCUITS ,Electronic engineering ,business ,Electronic circuit - Abstract
This paper presents the 3D integration concept of RF and millimeterwave circuits through the use of MEMS technologies. Silicon based Microsystems can then be developed and feature high performances thanks to the evolution of the SiGe and MEMS technologies and high compactness due to a 3D integration.
- Published
- 2005