9 results on '"Reichl, Herbert"'
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2. Measurement and analysis of the impact of micrometer scale cracks on the RF performance and reliability of transmission lines
3. A solder joint fatigue life model for combined vibration and temperature environments
4. The impacts of dimensions and return current path geometry on coupling in single ended Through Silicon Vias
5. Innovative approaches for realisation of embedded chip packages - Technological challenges and achievements
6. BCB with nano-filled BaSrTiO3 for thin film capacitors
7. Parameterization of bent coils on curved flexible surface substrates for RFID applications
8. Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints
9. Low cost wafer-level 3-D integration without TSV
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